S25FL512SAGBHIC10 datasheet, PDF

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S25FL512SAGBHIC10: DescriptionFlash, 128MX4, PBGA24, FBGA-24; Categorystorage storage; File Size2MB，140 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S25FL512SAGBHIC10 Overview

Flash, 128MX4, PBGA24, FBGA-24

S25FL512SAGBHIC10 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SPANSION
package instruction	TBGA, BGA24,5X5,40
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
Other features	IT ALSO HAVE MEMORY WIDTH X1
Spare memory width	2
Maximum clock frequency (fCLK)	133 MHz
Data retention time - minimum	20
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PBGA-B24
length	8 mm
memory density	536870912 bit
Memory IC Type	FLASH
memory width	4
Number of functions	1
Number of terminals	24
word count	134217728 words
character code	128000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128MX4
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA24,5X5,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
Parallel/Serial	SERIAL
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Serial bus type	SPI
Maximum standby current	0.0001 A
Maximum slew rate	0.061 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
type	NOR TYPE
width	6 mm
write protect	HARDWARE/SOFTWARE

S25FL512SAGBHIC10 Related Products

	S25FL512SAGBHIC10	S25FL512SAGMFI011	S25FL512SAGBHI210
Description	Flash, 128MX4, PBGA24, FBGA-24	Flash, 128MX4, PDSO16, SOIC-16	Flash, 128MX4, PBGA24, FBGA-24
Is it Rohs certified?	conform to	conform to	conform to
package instruction	TBGA, BGA24,5X5,40	SOP, SOP16,.4	TBGA, BGA24,5X5,40
Reach Compliance Code	unknown	unknown	unknow
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Other features	IT ALSO HAVE MEMORY WIDTH X1	IT ALSO HAVE MEMORY WIDTH X1	IT ALSO HAVE MEMORY WIDTH X1
Spare memory width	2	2	2
Maximum clock frequency (fCLK)	133 MHz	133 MHz	133 MHz
Data retention time - minimum	20	20	20
Durability	100000 Write/Erase Cycles	100000 Write/Erase Cycles	100000 Write/Erase Cycles
JESD-30 code	R-PBGA-B24	R-PDSO-G16	R-PBGA-B24
length	8 mm	10.3 mm	8 mm
memory density	536870912 bit	536870912 bit	536870912 bi
Memory IC Type	FLASH	FLASH	FLASH
memory width	4	4	4
Number of functions	1	1	1
Number of terminals	24	16	24
word count	134217728 words	134217728 words	134217728 words
character code	128000000	128000000	128000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
organize	128MX4	128MX4	128MX4
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TBGA	SOP	TBGA
Encapsulate equivalent code	BGA24,5X5,40	SOP16,.4	BGA24,5X5,40
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE	SMALL OUTLINE	GRID ARRAY, THIN PROFILE
Parallel/Serial	SERIAL	SERIAL	SERIAL
power supply	3/3.3 V	3/3.3 V	3/3.3 V
Programming voltage	3 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	2.65 mm	1.2 mm
Serial bus type	SPI	SPI	SPI
Maximum standby current	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.061 mA	0.061 mA	0.061 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	GULL WING	BALL
Terminal pitch	1 mm	1.27 mm	1 mm
Terminal location	BOTTOM	DUAL	BOTTOM
type	NOR TYPE	NOR TYPE	NOR TYPE
width	6 mm	7.5 mm	6 mm
write protect	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE	HARDWARE/SOFTWARE
Maker	SPANSION	-	SPANSION

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