PCI Bus Controller, CMOS, PBGA484, PLASTIC, BGA-484
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | QuickLogic Corporation |
Parts packaging code | BGA |
package instruction | BGA, BGA484,22X22,40 |
Contacts | 484 |
Reach Compliance Code | compliant |
ECCN code | 3A001.A.3 |
Address bus width | 64 |
Bus compatibility | PCI |
maximum clock frequency | 100 MHz |
Maximum data transfer rate | 533 MBps |
Drive interface standards | IEEE 1149.1A |
External data bus width | 64 |
JESD-30 code | S-PBGA-B484 |
JESD-609 code | e0 |
length | 23 mm |
Humidity sensitivity level | 3 |
Number of terminals | 484 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA484,22X22,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3,3.3/5 V |
Certification status | Not Qualified |
Maximum seat height | 2.14 mm |
Maximum slew rate | 100 mA |
Maximum supply voltage | 3.6 V |
Minimum supply voltage | 3 V |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 23 mm |
uPs/uCs/peripheral integrated circuit type | BUS CONTROLLER, PCI |
QL5064-66BPB484C | QL5064-33BPB484C | QL5064-33APB484I | QL5064-75CPB456I | QL5064-66APB484I | QL5064-66APB456I | QL5064-33BPB456I | |
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Description | PCI Bus Controller, CMOS, PBGA484, PLASTIC, BGA-484 | PCI Bus Controller, CMOS, PBGA484, PLASTIC, BGA-484 | PCI Bus Controller, CMOS, PBGA484, PLASTIC, BGA-484 | PCI Bus Controller, CMOS, PBGA456, PLASTIC, BGA-456 | PCI Bus Controller, CMOS, PBGA484, PLASTIC, BGA-484 | PCI Bus Controller, CMOS, PBGA456, PLASTIC, BGA-456 | PCI Bus Controller, CMOS, PBGA456, PLASTIC, BGA-456 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
package instruction | BGA, BGA484,22X22,40 | BGA, BGA484,22X22,40 | BGA, BGA484,22X22,40 | BGA, BGA456,26X26,50 | BGA, BGA484,22X22,40 | BGA, BGA456,26X26,50 | BGA, BGA456,26X26,50 |
Contacts | 484 | 484 | 484 | 456 | 484 | 456 | 456 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN code | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A991.A.2 |
Address bus width | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
Bus compatibility | PCI | PCI | PCI | PCI | PCI | PCI | PCI |
maximum clock frequency | 100 MHz | 100 MHz | 100 MHz | 75 MHz | 100 MHz | 66 MHz | 33 MHz |
Drive interface standards | IEEE 1149.1A | IEEE 1149.1A | IEEE 1149.1A | IEEE 1149.1A | IEEE 1149.1A | IEEE 1149.1A | IEEE 1149.1A |
External data bus width | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
JESD-30 code | S-PBGA-B484 | S-PBGA-B484 | S-PBGA-B484 | S-PBGA-B456 | S-PBGA-B484 | S-PBGA-B456 | S-PBGA-B456 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 23 mm | 23 mm | 23 mm | 35 mm | 23 mm | 35 mm | 35 mm |
Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Number of terminals | 484 | 484 | 484 | 456 | 484 | 456 | 456 |
Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | - | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
Encapsulate equivalent code | BGA484,22X22,40 | BGA484,22X22,40 | BGA484,22X22,40 | BGA456,26X26,50 | BGA484,22X22,40 | BGA456,26X26,50 | BGA456,26X26,50 |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 225 | NOT SPECIFIED | 225 | NOT SPECIFIED |
power supply | 3.3,3.3/5 V | 3.3,3.3/5 V | 3.3,3.3/5 V | 3.3,3.3/5 V | 3.3,3.3/5 V | 3.3,3.3/5 V | 3.3,3.3/5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 2.14 mm | 2.14 mm | 2.14 mm | 2.52 mm | 2.14 mm | 2.52 mm | 2.52 mm |
Maximum slew rate | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA |
Maximum supply voltage | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 1 mm | 1 mm | 1 mm | 1.27 mm | 1 mm | 1.27 mm | 1.27 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 23 mm | 23 mm | 23 mm | 35 mm | 23 mm | 35 mm | 35 mm |
uPs/uCs/peripheral integrated circuit type | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI | BUS CONTROLLER, PCI |
Is it lead-free? | Contains lead | Contains lead | Contains lead | - | Contains lead | - | - |
Maker | QuickLogic Corporation | - | QuickLogic Corporation | QuickLogic Corporation | QuickLogic Corporation | QuickLogic Corporation | QuickLogic Corporation |
Maximum data transfer rate | 533 MBps | - | - | 600 MBps | 533 MBps | 533 MBps | - |