IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,LLCC,20PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Texas Instruments |
package instruction | QCCN, LCC20,.35SQ |
Reach Compliance Code | not_compliant |
JESD-30 code | S-XQCC-N20 |
Logic integrated circuit type | NAND GATE |
Number of terminals | 20 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | CERAMIC |
encapsulated code | QCCN |
Encapsulate equivalent code | LCC20,.35SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
power supply | 2/6 V |
Schmitt trigger | NO |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
SN74HC00FHP4 | SN74HC00NP3 | SN74HC00FH4 | SN74HC00FN3 | SN74HC00FN | SN74HC00JP4 | SN74HC00J4 | |
---|---|---|---|---|---|---|---|
Description | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,LLCC,20PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,LLCC,20PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,LDCC,20PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,LDCC,20PIN,PLASTIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC | IC,LOGIC GATE,QUAD 2-INPUT NAND,HC-CMOS,DIP,14PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
package instruction | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | QCCN, LCC20,.35SQ | QCCJ, LDCC20,.4SQ | QCCJ, LDCC20,.4SQ | DIP, DIP14,.3 | DIP, DIP14,.3 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli | _compli |
JESD-30 code | S-XQCC-N20 | R-PDIP-T14 | S-XQCC-N20 | S-PQCC-J20 | S-PQCC-J20 | R-XDIP-T14 | R-XDIP-T14 |
Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
Number of terminals | 20 | 14 | 20 | 20 | 20 | 14 | 14 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
encapsulated code | QCCN | DIP | QCCN | QCCJ | QCCJ | DIP | DIP |
Encapsulate equivalent code | LCC20,.35SQ | DIP14,.3 | LCC20,.35SQ | LDCC20,.4SQ | LDCC20,.4SQ | DIP14,.3 | DIP14,.3 |
Package shape | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
Package form | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE |
power supply | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V |
Schmitt trigger | NO | NO | NO | NO | NO | NO | NO |
surface mount | YES | NO | YES | YES | YES | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal form | NO LEAD | THROUGH-HOLE | NO LEAD | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | QUAD | DUAL | QUAD | QUAD | QUAD | DUAL | DUAL |