S29PL032J55BFI150 datasheet, PDF

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S29PL032J55BFI150: DescriptionFlash, 2MX16, 55ns, PBGA56, FBGA-56; Categorystorage storage; File Size8MB，101 Pages; ManufacturerCypress Semiconductor; Environmental Compliance

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S29PL032J55BFI150 Overview

Flash, 2MX16, 55ns, PBGA56, FBGA-56

S29PL032J55BFI150 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Cypress Semiconductor
package instruction	VFBGA, BGA56,8X8,32
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
Maximum access time	55 ns
Other features	TOP AND BOTTOM BOOT BLOCK
startup block	BOTTOM/TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B56
JESD-609 code	e1
length	9 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	16,62
Number of terminals	56
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Encapsulate equivalent code	BGA56,8X8,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
page size	8 words
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1 mm
Department size	4K,32K
Maximum standby current	0.000005 A
Maximum slew rate	0.07 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
switch bit	YES
type	NOR TYPE
width	7 mm

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