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K9F1G08D0A-YIB00

Description
Flash, 128MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Categorystorage    storage   
File Size637KB,36 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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K9F1G08D0A-YIB00 Overview

Flash, 128MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48

K9F1G08D0A-YIB00 Parametric

Parameter NameAttribute value
MakerSAMSUNG
Parts packaging codeTSOP1
package instruction12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
Contacts48
Reach Compliance Codeunknown
ECCN code3A991.B.1.A
Maximum access time30 ns
Other featuresCONTAINS ADDITIONAL 32M BIT SPARE MEMORY
JESD-30 codeR-PDSO-G48
length18.4 mm
memory density1073741824 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals48
word count134217728 words
character code128000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP1
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Parallel/SerialPARALLEL
Programming voltage2.7 V
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)2.9 V
Minimum supply voltage (Vsup)2.4 V
Nominal supply voltage (Vsup)2.65 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
typeSLC NAND TYPE
width12 mm

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Description Flash, 128MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 Flash, 128MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 Flash, 128MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 Flash, 128MX8, 35ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 Flash, 128MX8, 35ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 Flash, 128MX8, 35ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 Flash, 128MX8, 35ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 Flash, 128MX8, 30ns, PDSO48, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
Parts packaging code TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1
package instruction 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48 TSOP1, TSOP1, 12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
Contacts 48 48 48 48 48 48 48 48
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
Maximum access time 30 ns 30 ns 30 ns 35 ns 35 ns 35 ns 35 ns 30 ns
Other features CONTAINS ADDITIONAL 32M BIT SPARE MEMORY CONTAINS ADDITIONAL 32M BIT SPARE MEMORY CONTAINS ADDITIONAL 32M BIT SPARE MEMORY CONTAINS ADDITIONAL 32M BIT SPARE MEMORY CONTAINS ADDITIONAL 32M BIT SPARE MEMORY CONTAINS ADDITIONAL 32M BIT SPARE MEMORY CONTAINS ADDITIONAL 32M BIT SPARE MEMORY CONTAINS ADDITIONAL 32M BIT SPARE MEMORY
JESD-30 code R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48 R-PDSO-G48
length 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm 18.4 mm
memory density 1073741824 bit 1073741824 bit 1073741824 bit 1073741824 bit 1073741824 bit 1073741824 bit 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH FLASH FLASH FLASH FLASH FLASH FLASH
memory width 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1
Number of terminals 48 48 48 48 48 48 48 48
word count 134217728 words 134217728 words 134217728 words 134217728 words 134217728 words 134217728 words 134217728 words 134217728 words
character code 128000000 128000000 128000000 128000000 128000000 128000000 128000000 128000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 70 °C 70 °C 70 °C 85 °C 70 °C 85 °C 85 °C
organize 128MX8 128MX8 128MX8 128MX8 128MX8 128MX8 128MX8 128MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1 TSOP1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Programming voltage 2.7 V 2.7 V 2.7 V 1.8 V 1.8 V 1.8 V 1.8 V 2.7 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 2.9 V 2.9 V 2.9 V 1.95 V 1.95 V 1.95 V 1.95 V 2.9 V
Minimum supply voltage (Vsup) 2.4 V 2.4 V 2.4 V 1.7 V 1.7 V 1.7 V 1.7 V 2.4 V
Nominal supply voltage (Vsup) 2.65 V 2.65 V 2.65 V 1.8 V 1.8 V 1.8 V 1.8 V 2.65 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
type SLC NAND TYPE SLC NAND TYPE NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE SLC NAND TYPE
width 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm 12 mm
Maker SAMSUNG SAMSUNG - SAMSUNG SAMSUNG SAMSUNG SAMSUNG SAMSUNG

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