Synchronous DRAM, 2MX32, 7ns, CMOS, PBGA90, FBGA-90
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SAMSUNG |
| Parts packaging code | BGA |
| package instruction | LFBGA, |
| Contacts | 90 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| access mode | FOUR BANK PAGE BURST |
| Maximum access time | 7 ns |
| Other features | AUTO/SELF REFRESH |
| JESD-30 code | R-PBGA-B90 |
| length | 13 mm |
| memory density | 67108864 bit |
| Memory IC Type | SYNCHRONOUS DRAM |
| memory width | 32 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 90 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -25 °C |
| organize | 2MX32 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LFBGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 240 |
| Certification status | Not Qualified |
| Maximum seat height | 1.4 mm |
| self refresh | YES |
| Maximum supply voltage (Vsup) | 2.7 V |
| Minimum supply voltage (Vsup) | 2.3 V |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
| width | 8 mm |
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