LM158AH-MLS datasheet, PDF - EEWORLD Datasheet

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LM158AH-MLS: DescriptionIC DUAL OP-AMP, 4000 uV OFFSET-MAX, 1 MHz BAND WIDTH, MBCY8, METAL CAN, TO-5, 8 PIN, Operational Amplifier; CategoryAnalog mixed-signal IC Amplifier circuit; File Size518KB，24 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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LM158AH-MLS Overview

IC DUAL OP-AMP, 4000 uV OFFSET-MAX, 1 MHz BAND WIDTH, MBCY8, METAL CAN, TO-5, 8 PIN, Operational Amplifier

LM158AH-MLS Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
Parts packaging code	BCY
package instruction	TO-5, CAN8,.2
Contacts	8
Reach Compliance Code	unknown
ECCN code	EAR99
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	0.1 µA
Maximum bias current (IIB) at 25C	0.05 µA
Nominal Common Mode Rejection Ratio	85 dB
frequency compensation	YES
Maximum input offset voltage	4000 µV
JESD-30 code	O-MBCY-W8
JESD-609 code	e0
low-dissonance	NO
Negative supply voltage upper limit
Nominal Negative Supply Voltage (Vsup)
Number of functions	2
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	METAL
encapsulated code	TO-5
Encapsulate equivalent code	CAN8,.2
Package shape	ROUND
Package form	CYLINDRICAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	+-1.5/+-15/3/30 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Nominal slew rate	0.5 V/us
Maximum slew rate	2 mA
Supply voltage upper limit	32 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	WIRE
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	1000 kHz
Minimum voltage gain	25000

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Is it Rohs certified?	incompatible	conform to	conform to	conform to	conform to	conform to	conform to
package instruction	TO-5, CAN8,.2	, DIE OR CHIP	DIE, DIE OR CHIP	, WAFER	DIE, WAFER	, WAFER	DIE, DIE OR CHIP
Reach Compliance Code	unknown	compliant	compliant	compliant	compliant	compliant	compliant
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
Maximum bias current (IIB) at 25C	0.05 µA	0.05 µA	0.05 µA	0.25 µA	0.25 µA	0.25 µA	0.25 µA
frequency compensation	YES	YES	YES	YES	YES	YES	YES
Maximum input offset voltage	4000 µV	4000 µV	7000 µV	10000 µV	10000 µV	9000 µV	9000 µV
low-dissonance	NO	NO	NO	NO	NO	NO	NO
Number of functions	2	2	2	2	2	2	2
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C	85 °C	70 °C	70 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C	-40 °C	-	-
Encapsulate equivalent code	CAN8,.2	DIE OR CHIP	DIE OR CHIP	WAFER	WAFER	WAFER	DIE OR CHIP
power supply	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-13/3/26 V	+-1.5/+-13/3/26 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	2 mA	2 mA	2 mA	2 mA	2 mA	2 mA	2 mA
Supply voltage upper limit	32 V	16 V	32 V	13 V	26 V	32 V	32 V
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Minimum voltage gain	25000	25000	25000	15000	15000	15000	15000
Maker	National Semiconductor（TI ）	-	-	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）	National Semiconductor（TI ）
Parts packaging code	BCY	-	WAFER	-	WAFER	WAFER	WAFER
ECCN code	EAR99	-	EAR99	-	EAR99	EAR99	EAR99
Maximum average bias current (IIB)	0.1 µA	-	0.3 µA	-	0.5 µA	0.5 µA	0.5 µA
Nominal Common Mode Rejection Ratio	85 dB	-	85 dB	-	70 dB	85 dB	85 dB
JESD-30 code	O-MBCY-W8	-	X-XUUC-N	-	X-XUUC-N	X-XUUC-N	X-XUUC-N
Package body material	METAL	-	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	TO-5	-	DIE	-	DIE	-	DIE
Package shape	ROUND	-	UNSPECIFIED	-	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Package form	CYLINDRICAL	-	UNCASED CHIP	-	UNCASED CHIP	UNCASED CHIP	UNCASED CHIP
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	260	-	260	260	260
Nominal slew rate	0.5 V/us	-	0.5 V/us	-	0.1 V/us	0.1 V/us	0.1 V/us
Nominal supply voltage (Vsup)	5 V	-	5 V	-	5 V	5 V	5 V
surface mount	NO	-	YES	-	YES	YES	YES
Terminal form	WIRE	-	NO LEAD	-	NO LEAD	NO LEAD	NO LEAD
Terminal location	BOTTOM	-	UPPER	-	UPPER	UPPER	UPPER
Maximum time at peak reflow temperature	NOT SPECIFIED	-	40	-	40	40	40
Nominal Uniform Gain Bandwidth	1000 kHz	1000 kHz	1000 kHz	-	1000 kHz	1000 kHz	1000 kHz
Humidity sensitivity level	-	1	1	1	1	1	1

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