IC,SAMPLE/TRACK-AND-HOLD AMPLIFIER,SINGLE,BICMOS,DIP,8PIN,CERAMIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Renesas Electronics Corporation |
Parts packaging code | DIP |
Contacts | 8 |
Reach Compliance Code | not_compliant |
Amplifier type | SAMPLE AND HOLD CIRCUIT |
JESD-30 code | R-XDIP-T8 |
JESD-609 code | e0 |
Nominal Negative Supply Voltage (Vsup) | -5 V |
Number of functions | 1 |
Number of terminals | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP8,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | +-5 V |
Certification status | Not Qualified |
Maximum slew rate | 22 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | BICMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
HA5351IJ | HA5350IP | HA5350IJ | HA5350IB | |
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Description | IC,SAMPLE/TRACK-AND-HOLD AMPLIFIER,SINGLE,BICMOS,DIP,8PIN,CERAMIC | IC,SAMPLE/TRACK-AND-HOLD AMPLIFIER,DUAL,BICMOS,DIP,14PIN,PLASTIC | IC,SAMPLE/TRACK-AND-HOLD AMPLIFIER,DUAL,BICMOS,DIP,14PIN,CERAMIC | IC,SAMPLE/TRACK-AND-HOLD AMPLIFIER,DUAL,BICMOS,SOP,14PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
Parts packaging code | DIP | DIP | DIP | SOIC |
Contacts | 8 | 14 | 14 | 14 |
Reach Compliance Code | not_compliant | not_compliant | _compli | _compli |
Amplifier type | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT |
JESD-30 code | R-XDIP-T8 | R-PDIP-T14 | R-XDIP-T14 | R-PDSO-G14 |
JESD-609 code | e0 | e0 | e0 | e0 |
Nominal Negative Supply Voltage (Vsup) | -5 V | -5 V | -5 V | -5 V |
Number of functions | 1 | 2 | 2 | 2 |
Number of terminals | 8 | 14 | 14 | 14 |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | SOP |
Encapsulate equivalent code | DIP8,.3 | DIP14,.3 | DIP14,.3 | SOP14,.25 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
power supply | +-5 V | +-5 V | +-5 V | +-5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum slew rate | 22 mA | 22 mA | 22 mA | 22 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | YES |
technology | BICMOS | BICMOS | BICMOS | BICMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |