Prescaler, ECL Series, 1-Func, ECL
| Parameter Name | Attribute value |
| Maker | Dynex |
| package instruction | DIE, |
| Reach Compliance Code | unknown |
| series | ECL |
| JESD-30 code | X-XUUC-N8 |
| Logic integrated circuit type | PRESCALER |
| Number of data/clock inputs | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | -30 °C |
| Output characteristics | EMITTER FOLLOWER |
| Output polarity | COMPLEMENTARY |
| Package body material | UNSPECIFIED |
| encapsulated code | DIE |
| Package shape | UNSPECIFIED |
| Package form | UNCASED CHIP |
| Maximum supply current (ICC) | 70 mA |
| propagation delay (tpd) | 6 ns |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | ECL |
| Temperature level | OTHER |
| Terminal form | NO LEAD |
| Terminal location | UPPER |
| minfmax | 500 MHz |
| SP8685NA1C | SP8685ACDG | SP8685ADG | SP8685ADG/883B | SP8685BDG | |
|---|---|---|---|---|---|
| Description | Prescaler, ECL Series, 1-Func, ECL | Prescaler, ECL Series, 1-Func, ECL, CDIP16 | Prescaler, ECL Series, 1-Func, ECL, CDIP16 | Prescaler, 8685 Series, 1-Func, ECL, CDIP16, DIP-16 | Prescaler, ECL Series, 1-Func, ECL, CDIP16 |
| package instruction | DIE, | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| series | ECL | ECL | ECL | 8685 | ECL |
| JESD-30 code | X-XUUC-N8 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 |
| Logic integrated circuit type | PRESCALER | PRESCALER | PRESCALER | PRESCALER | PRESCALER |
| Number of data/clock inputs | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C |
| Minimum operating temperature | -30 °C | -55 °C | -55 °C | -55 °C | -30 °C |
| Output polarity | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| Package body material | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIE | DIP | DIP | DIP | DIP |
| Package shape | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | UNCASED CHIP | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| propagation delay (tpd) | 6 ns | 6 ns | 6 ns | 6 ns | 6 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | NO | NO | NO | NO |
| technology | ECL | ECL | ECL | ECL | ECL |
| Temperature level | OTHER | MILITARY | MILITARY | MILITARY | OTHER |
| Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal location | UPPER | DUAL | DUAL | DUAL | DUAL |
| minfmax | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 500 MHz |
| Maker | Dynex | - | Dynex | Dynex | Dynex |
| Output characteristics | EMITTER FOLLOWER | EMITTER FOLLOWER | EMITTER FOLLOWER | - | EMITTER FOLLOWER |
| Maximum supply current (ICC) | 70 mA | 70 mA | 70 mA | - | 70 mA |
| Is it Rohs certified? | - | incompatible | incompatible | - | incompatible |
| JESD-609 code | - | e0 | e0 | - | e0 |
| Maximum Frequency@Nom-Sup | - | 500000000 Hz | 500000000 Hz | - | 500000000 Hz |
| Encapsulate equivalent code | - | DIP16,.3 | DIP16,.3 | - | DIP16,.3 |
| Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
| power supply | - | -5.2 V | -5.2 V | - | -5.2 V |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Terminal pitch | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
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