TOS6133AY datasheet, PDF - EEWORLD Datasheet

TOS6133AY: DescriptionOptoelectronic Device; CategoryLED optoelectronic/LED photoelectric; File Size112KB，1 Pages; ManufacturerOasistek; Websitehttp://www.oasistek.com/cn/index.php; Oasistek was founded in 1974 by Mr. Li Mingshun, founder and chairman. Adhering to the corporate spirit of "ordinary, sincere, trustworthy, reliable, growth and innovation", it is committed to the production and research and development of light emitting diode (LED) related components, such as plastic molds, plastic injection, printed circuit boards, LED packaging and finished lamp design. Dongguan Lizhou Electronic Technology Co., Ltd. is the mainland production base of Oasistek Lizhou Technology. It is a professional production and processing company of LED and electronic related products with a complete and scientific quality management system. Dongguan Lizhou Electronic Technology Co., Ltd. is recognized by the industry for its integrity, strength and product quality. Friends from all walks of life are welcome to visit, guide and negotiate business.

Download Datasheet Parametric View All

TOS6133AY Overview

Optoelectronic Device

How is the storage period of components calculated?: Let's first use the following figure to understand the classification of components :Definition of storage period of components: Storage period ts : The time components are stored under certain enviro...; 火辣西米秀 Analogue and Mixed Signal

The Definitive Guide to FPGA Rapid System Prototyping (Chinese): The authoritative guide to FPGA rapid system prototyping is intended for engineers who are interested in using FPGAs for product development. The main purpose of this book is to introduce the necessar...; arui1999 Download Centre

Temperature problems solved for you (IV) Ambient temperature monitoring: In the previous three articles, we have introduced the basic principles of temperature sensors and how to monitor circuit board temperature. In many applications, ambient air temperature monitoring is...; EEWORLD社区 TI Technology Forum

LGA-12 package soldering issues: 请问，LGA-12封装芯片贴上PCB板子后，发现个别芯片脱落，而芯片的焊盘粘在PCB板子上，也就是说，芯片跟芯片的焊脚分开了。请问有谁知道这是什么原因引起的麽？...; xinapak TI Technology Forum

[NXP Rapid IoT Review] +3.rapid-iot-studio example bin summary: [i=s]This post was last edited by chrisrh on 2018-12-29 19:46[/i] [size=4][color=#800080]First upload a bookmarked user manual:[/color][/size] [color=#000000][/color] [img]static/image/hrline/5.gif[/i...; chrisrh RF/Wirelessly

GD32E231 Learning 4: External Interrupt EXTI: [align=left]Each GPIO of E321 can be configured as an external interrupt, which is divided into three groups: EXTI0_1_IRQn, EXTI2_3_IRQn, and EXTI4_15_IRQn. Three interrupt functions are used to proce...; wudianjun2001 GD32 MCU

Popular Components