1MX16 FLASH 3V PROM, 70ns, PBGA48, 8 X 9 MM, 0.80 MM PITCH, FBGA-48
Parameter Name | Attribute value |
Maker | SPANSION |
Parts packaging code | BGA |
package instruction | 8 X 9 MM, 0.80 MM PITCH, FBGA-48 |
Contacts | 48 |
Reach Compliance Code | unknown |
Maximum access time | 70 ns |
Other features | EMBEDDED ALGORITHMS; 20 YEARS DATA RETENTION |
Spare memory width | 8 |
JESD-30 code | R-PBGA-B48 |
JESD-609 code | e1 |
length | 9 mm |
memory density | 16777216 bit |
Memory IC Type | FLASH |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 48 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
organize | 1MX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 240 |
Programming voltage | 3 V |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 8 mm |