MT58L1MY32PF-7.5 datasheet, PDF

MT58L1MY32PF-7.5: DescriptionStandard SRAM, 1MX32, 4ns, CMOS, PBGA165, 13 X 15 MM, MO-216, FBGA-165; Categorystorage storage; File Size533KB，34 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT58L1MY32PF-7.5 Overview

Standard SRAM, 1MX32, 4ns, CMOS, PBGA165, 13 X 15 MM, MO-216, FBGA-165

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Micron Technology
Parts packaging code	BGA
package instruction	13 X 15 MM, MO-216, FBGA-165
Contacts	165
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	4 ns
Other features	PIPELINED ARCHITECTURE
I/O type	COMMON
JESD-30 code	R-PBGA-B165
JESD-609 code	e0
length	17 mm
memory density	33554432 bit
Memory IC Type	STANDARD SRAM
memory width	32
Humidity sensitivity level	1
Number of functions	1
Number of terminals	165
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA165,11X15,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	235
power supply	2.5/3.3,3.3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum standby current	0.03 A
Minimum standby current	3.14 V
Maximum slew rate	0.34 mA
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD SILVER
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	15 mm

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