Flash, 2MX16, 100ns, PBGA64,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| package instruction | BGA, BGA64,8X8,40 |
| Reach Compliance Code | unknown |
| Maximum access time | 100 ns |
| Spare memory width | 8 |
| command user interface | YES |
| Universal Flash Interface | YES |
| Data polling | YES |
| JESD-30 code | S-PBGA-B64 |
| JESD-609 code | e0 |
| memory density | 33554432 bit |
| Memory IC Type | FLASH |
| memory width | 16 |
| Number of departments/size | 64 |
| Number of terminals | 64 |
| word count | 2097152 words |
| character code | 2000000 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 2MX16 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | BGA |
| Encapsulate equivalent code | BGA64,8X8,40 |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| page size | 4/8 words |
| Parallel/Serial | PARALLEL |
| power supply | 3/3.3 V |
| Certification status | Not Qualified |
| ready/busy | YES |
| Department size | 64K |
| Maximum standby current | 0.000005 A |
| Maximum slew rate | 0.06 mA |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| switch bit | YES |
| type | NOR TYPE |
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