K7N403601B_06 datasheet, PDF - EEWORLD Datasheet

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K7N403601B_06: Description128Kx36 & 256Kx18 Pipelined NtRAM; File Size413KB，20 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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K7N403601B_06 Overview

128Kx36 & 256Kx18 Pipelined NtRAM

K7N403601B_06 Related Products

	K7N403601B_06	K7N401801B-QC13	K7N403601B-QI13	K7N401801B	K7N401801B-QI13	K7N403601B-QC13
Description	128Kx36 & 256Kx18 Pipelined NtRAM	128Kx36 & 256Kx18 Pipelined NtRAM	128Kx36 & 256Kx18 Pipelined NtRAM	128Kx36 & 256Kx18 Pipelined NtRAM	128Kx36 & 256Kx18 Pipelined NtRAM	128Kx36 & 256Kx18 Pipelined NtRAM
Is it Rohs certified?	-	incompatible	incompatible	-	incompatible	incompatible
Parts packaging code	-	QFP	QFP	-	QFP	QFP
package instruction	-	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87	-	LQFP, QFP100,.63X.87	LQFP, QFP100,.63X.87
Contacts	-	100	100	-	100	100
Reach Compliance Code	-	compli	compli	-	compli	compli
ECCN code	-	3A991.B.2.A	3A991.B.2.A	-	3A991.B.2.A	3A991.B.2.A
Maximum access time	-	4.2 ns	4.2 ns	-	4.2 ns	4.2 ns
Other features	-	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	-	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	-	166 MHz	133 MHz	-	166 MHz	133 MHz
I/O type	-	COMMON	COMMON	-	COMMON	COMMON
JESD-30 code	-	R-PQFP-G100	R-PQFP-G100	-	R-PQFP-G100	R-PQFP-G100
JESD-609 code	-	e0	e0	-	e0	e0
length	-	20 mm	20 mm	-	20 mm	20 mm
memory density	-	4718592 bi	4718592 bi	-	4718592 bi	4718592 bi
Memory IC Type	-	ZBT SRAM	ZBT SRAM	-	ZBT SRAM	ZBT SRAM
memory width	-	18	36	-	18	36
Number of functions	-	1	1	-	1	1
Number of terminals	-	100	100	-	100	100
word count	-	262144 words	131072 words	-	262144 words	131072 words
character code	-	256000	128000	-	256000	128000
Operating mode	-	SYNCHRONOUS	SYNCHRONOUS	-	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	-	70 °C	85 °C	-	85 °C	70 °C
organize	-	256KX18	128KX36	-	256KX18	128KX36
Output characteristics	-	3-STATE	3-STATE	-	3-STATE	3-STATE
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	-	LQFP	LQFP	-	LQFP	LQFP
Encapsulate equivalent code	-	QFP100,.63X.87	QFP100,.63X.87	-	QFP100,.63X.87	QFP100,.63X.87
Package shape	-	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Package form	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	-	PARALLEL	PARALLEL	-	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
power supply	-	2.5/3.3,3.3 V	2.5/3.3,3.3 V	-	2.5/3.3,3.3 V	2.5/3.3,3.3 V
Certification status	-	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Maximum seat height	-	1.6 mm	1.6 mm	-	1.6 mm	1.6 mm
Maximum standby current	-	0.05 A	0.05 A	-	0.05 A	0.05 A
Minimum standby current	-	3.14 V	3.14 V	-	3.14 V	3.14 V
Maximum slew rate	-	0.25 mA	0.25 mA	-	0.25 mA	0.25 mA
Maximum supply voltage (Vsup)	-	3.465 V	3.465 V	-	3.465 V	3.465 V
Minimum supply voltage (Vsup)	-	3.135 V	3.135 V	-	3.135 V	3.135 V
Nominal supply voltage (Vsup)	-	3.3 V	3.3 V	-	3.3 V	3.3 V
surface mount	-	YES	YES	-	YES	YES
technology	-	CMOS	CMOS	-	CMOS	CMOS
Temperature level	-	COMMERCIAL	INDUSTRIAL	-	INDUSTRIAL	COMMERCIAL
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	-	GULL WING	GULL WING	-	GULL WING	GULL WING
Terminal pitch	-	0.65 mm	0.65 mm	-	0.65 mm	0.65 mm
Terminal location	-	QUAD	QUAD	-	QUAD	QUAD
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED
width	-	14 mm	14 mm	-	14 mm	14 mm

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