S29CL016J1MFAM130 datasheet, PDF

S29CL016J1MFAM130: DescriptionFlash, 512KX32, 54ns, PBGA80, 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-80; Categorystorage storage; File Size2MB，78 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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S29CL016J1MFAM130 Overview

Flash, 512KX32, 54ns, PBGA80, 13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-80

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SPANSION
Parts packaging code	BGA
package instruction	13 X 11 MM, 1 MM PITCH, FORTIFIED, BGA-80
Contacts	80
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	54 ns
Other features	TOP BOOT BLOCK
startup block	BOTTOM
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PBGA-B80
JESD-609 code	e0
length	13 mm
memory density	16777216 bit
Memory IC Type	FLASH
Humidity sensitivity level	3
Number of functions	1
Number of departments/size	16,30
Number of terminals	80
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
organize	512KX32
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA80,8X10,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	1.8/3.3,3.3 V
Programming voltage	3.3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.4 mm
Department size	2K,16K
Maximum standby current	0.00006 A
Maximum slew rate	0.09 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
switch bit	YES
type	NOR TYPE
width	11 mm

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