Processor Specific Clock Generator, 24MHz, CMOS, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | AMD |
Parts packaging code | DIP |
package instruction | DIP, DIP24,.3 |
Contacts | 24 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
JESD-30 code | R-GDIP-T24 |
JESD-609 code | e0 |
length | 32.0675 mm |
Number of terminals | 24 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Maximum output clock frequency | 24 MHz |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Encapsulate equivalent code | DIP24,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
Filter level | MIL-STD-883 Class C |
Maximum seat height | 5.715 mm |
Maximum supply voltage | 5.5 V |
Minimum supply voltage | 4.5 V |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
uPs/uCs/peripheral integrated circuit type | CLOCK GENERATOR, PROCESSOR SPECIFIC |
AM8127DM | AM8127LMB | AM8127LCB | AM8127XC | AM8127XM | AM8127DC | AM8127DCB | AM8127LM | AM8127DMB | AM8127LC | |
---|---|---|---|---|---|---|---|---|---|---|
Description | Processor Specific Clock Generator, 24MHz, CMOS, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | Processor Specific Clock Generator, 24MHz, CMOS, CQCC28, LCC-28 | Processor Specific Clock Generator, 24MHz, CMOS, CQCC28, LCC-28 | Processor Specific Clock Generator, 24MHz, CMOS, 0.096 X 0.088 INCH, DIE-24 | Processor Specific Clock Generator, 24MHz, CMOS, 0.096 X 0.088 INCH, DIE-24 | Processor Specific Clock Generator, 24MHz, CMOS, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | Processor Specific Clock Generator, 24MHz, CMOS, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | Processor Specific Clock Generator, 24MHz, CMOS, CQCC28, LCC-28 | Processor Specific Clock Generator, 24MHz, CMOS, CDIP24, 0.300 INCH, SLIM, CERAMIC, DIP-24 | Processor Specific Clock Generator, 24MHz, CMOS, CQCC28, LCC-28 |
Maker | AMD | AMD | AMD | AMD | AMD | AMD | AMD | AMD | AMD | AMD |
Parts packaging code | DIP | QLCC | QLCC | DIE | DIE | DIP | DIP | QLCC | DIP | QLCC |
package instruction | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | QCCN, LCC28,.45SQ | DIE, | DIE, | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | QCCN, LCC28,.45SQ |
Contacts | 24 | 28 | 28 | 24 | 24 | 24 | 24 | 28 | 24 | 28 |
Reach Compliance Code | compliant | compliant | compliant | unknown | unknown | compliant | compliant | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
JESD-30 code | R-GDIP-T24 | S-CQCC-N28 | S-CQCC-N28 | R-XUUC-N24 | R-XUUC-N24 | R-GDIP-T24 | R-GDIP-T24 | S-CQCC-N28 | R-GDIP-T24 | S-CQCC-N28 |
Number of terminals | 24 | 28 | 28 | 24 | 24 | 24 | 24 | 28 | 24 | 28 |
Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C |
Maximum output clock frequency | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | QCCN | QCCN | DIE | DIE | DIP | DIP | QCCN | DIP | QCCN |
Package shape | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
Package form | IN-LINE | CHIP CARRIER | CHIP CARRIER | UNCASED CHIP | UNCASED CHIP | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum supply voltage | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V |
Minimum supply voltage | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V |
Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES | YES | YES | NO | NO | YES | NO | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
Terminal form | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
Terminal location | DUAL | QUAD | QUAD | UPPER | UPPER | DUAL | DUAL | QUAD | DUAL | QUAD |
uPs/uCs/peripheral integrated circuit type | CLOCK GENERATOR, PROCESSOR SPECIFIC | CLOCK GENERATOR, PROCESSOR SPECIFIC | CLOCK GENERATOR, PROCESSOR SPECIFIC | CLOCK GENERATOR, PROCESSOR SPECIFIC | CLOCK GENERATOR, PROCESSOR SPECIFIC | CLOCK GENERATOR, PROCESSOR SPECIFIC | CLOCK GENERATOR, PROCESSOR SPECIFIC | CLOCK GENERATOR, PROCESSOR SPECIFIC | CLOCK GENERATOR, PROCESSOR SPECIFIC | CLOCK GENERATOR, PROCESSOR SPECIFIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | - | - | incompatible | incompatible | incompatible | incompatible | incompatible |
JESD-609 code | e0 | e0 | e0 | - | - | e0 | e0 | e0 | e0 | e0 |
length | 32.0675 mm | 8.89 mm | 8.89 mm | - | - | 32.0675 mm | 32.0675 mm | 8.89 mm | 32.0675 mm | 8.89 mm |
Encapsulate equivalent code | DIP24,.3 | LCC28,.45SQ | LCC28,.45SQ | - | - | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | DIP24,.3 | LCC28,.45SQ |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Maximum seat height | 5.715 mm | 2.54 mm | 2.54 mm | - | - | 5.715 mm | 5.715 mm | 2.54 mm | 5.715 mm | 2.54 mm |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | - | - | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 7.62 mm | 8.89 mm | 8.89 mm | - | - | 7.62 mm | 7.62 mm | 8.89 mm | 7.62 mm | 8.89 mm |