|
AT25256B-CUL-T |
AT25256B-XHL-B |
AT25256B-XHL-T |
AT25256B-MAHL-T |
AT25256B |
AT25128B-CUL-T |
AT25128B |
Description |
32K X 8 SPI BUS SERIAL EEPROM, PBGA8 |
16K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
16K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
32K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
16K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
16K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
16K X 8 SPI BUS SERIAL EEPROM, PDSO8 |
memory width |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
8 |
8 |
8 |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
85 Cel |
85 °C |
85 Cel |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 Cel |
-40 °C |
-40 Cel |
organize |
32KX8 |
32KX8 |
32KX8 |
32KX8 |
16K × 8 |
16KX8 |
16K × 8 |
surface mount |
YES |
YES |
YES |
YES |
Yes |
YES |
Yes |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal form |
BALL |
GULL WING |
GULL WING |
NO LEAD |
GULL WING |
BALL |
GULL WING |
Terminal location |
BOTTOM |
DUAL |
DUAL |
DUAL |
pair |
BOTTOM |
pair |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
- |
conform to |
- |
Parts packaging code |
BGA |
TSSOP |
TSSOP |
SON |
- |
BGA |
- |
package instruction |
VFBGA, BGA8,2X4,30 |
TSSOP, TSSOP8,.25 |
TSSOP, TSSOP8,.25 |
VSON, SOLCC8,.11,20 |
- |
VFBGA, BGA8,2X4,30 |
- |
Contacts |
8 |
8 |
8 |
8 |
- |
8 |
- |
Reach Compliance Code |
compli |
compli |
compli |
compli |
- |
compli |
- |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
EAR99 |
- |
Maximum clock frequency (fCLK) |
20 MHz |
5 MHz |
5 MHz |
5 MHz |
- |
5 MHz |
- |
Data retention time - minimum |
100 |
100 |
100 |
100 |
- |
100 |
- |
Durability |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
- |
1000000 Write/Erase Cycles |
- |
JESD-30 code |
R-PBGA-B8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-N8 |
- |
R-PBGA-B8 |
- |
JESD-609 code |
e3 |
e4 |
e4 |
e4 |
- |
e3 |
- |
length |
3.73 mm |
4.4 mm |
4.4 mm |
3 mm |
- |
3.73 mm |
- |
memory density |
262144 bi |
262144 bi |
262144 bi |
262144 bi |
- |
131072 bi |
- |
Memory IC Type |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
- |
EEPROM |
- |
word count |
32768 words |
32768 words |
32768 words |
32768 words |
- |
16384 words |
- |
character code |
32000 |
32000 |
32000 |
32000 |
- |
16000 |
- |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
- |
SYNCHRONOUS |
- |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
- |
encapsulated code |
VFBGA |
TSSOP |
TSSOP |
VSON |
- |
VFBGA |
- |
Encapsulate equivalent code |
BGA8,2X4,30 |
TSSOP8,.25 |
TSSOP8,.25 |
SOLCC8,.11,20 |
- |
BGA8,2X4,30 |
- |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
- |
RECTANGULAR |
- |
Package form |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, VERY THIN PROFILE |
- |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
- |
Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
- |
SERIAL |
- |
power supply |
2/5 V |
2/5 V |
2/5 V |
2/5 V |
- |
2/5 V |
- |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Not Qualified |
- |
Maximum seat height |
1 mm |
1.2 mm |
1.2 mm |
0.6 mm |
- |
1 mm |
- |
Serial bus type |
SPI |
SPI |
SPI |
SPI |
- |
SPI |
- |
Maximum standby current |
0.000003 A |
0.000003 A |
0.000003 A |
0.000003 A |
- |
0.000003 A |
- |
Maximum slew rate |
0.01 mA |
0.01 mA |
0.01 mA |
0.01 mA |
- |
0.01 mA |
- |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
- |
5.5 V |
- |
Minimum supply voltage (Vsup) |
1.8 V |
1.8 V |
1.8 V |
1.8 V |
- |
1.8 V |
- |
Nominal supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
- |
2.5 V |
- |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
- |
CMOS |
- |
Terminal surface |
MATTE TIN |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
NICKEL PALLADIUM GOLD |
- |
MATTE TIN |
- |
Terminal pitch |
0.75 mm |
0.65 mm |
0.65 mm |
0.5 mm |
- |
0.75 mm |
- |
width |
2.35 mm |
3 mm |
3 mm |
2 mm |
- |
2.35 mm |
- |
Maximum write cycle time (tWC) |
5 ms |
5 ms |
5 ms |
5 ms |
- |
5 ms |
- |
write protect |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
HARDWARE/SOFTWARE |
- |
HARDWARE/SOFTWARE |
- |