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AT25256B-CUL-T

Description
32K X 8 SPI BUS SERIAL EEPROM, PBGA8
Categorystorage    storage   
File Size1023KB,24 Pages
ManufacturerAtmel (Microchip)
Environmental Compliance
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AT25256B-CUL-T Overview

32K X 8 SPI BUS SERIAL EEPROM, PBGA8

AT25256B-CUL-T Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerAtmel (Microchip)
Parts packaging codeBGA
package instructionVFBGA, BGA8,2X4,30
Contacts8
Reach Compliance Codecompli
ECCN codeEAR99
Maximum clock frequency (fCLK)20 MHz
Data retention time - minimum100
Durability1000000 Write/Erase Cycles
JESD-30 codeR-PBGA-B8
JESD-609 codee3
length3.73 mm
memory density262144 bi
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count32768 words
character code32000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize32KX8
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Encapsulate equivalent codeBGA8,2X4,30
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialSERIAL
power supply2/5 V
Certification statusNot Qualified
Maximum seat height1 mm
Serial bus typeSPI
Maximum standby current0.000003 A
Maximum slew rate0.01 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
width2.35 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE/SOFTWARE

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Description 32K X 8 SPI BUS SERIAL EEPROM, PBGA8 16K X 8 SPI BUS SERIAL EEPROM, PDSO8 16K X 8 SPI BUS SERIAL EEPROM, PDSO8 32K X 8 SPI BUS SERIAL EEPROM, PDSO8 16K X 8 SPI BUS SERIAL EEPROM, PDSO8 16K X 8 SPI BUS SERIAL EEPROM, PDSO8 16K X 8 SPI BUS SERIAL EEPROM, PDSO8
memory width 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1
Number of terminals 8 8 8 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 Cel 85 °C 85 Cel
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 Cel -40 °C -40 Cel
organize 32KX8 32KX8 32KX8 32KX8 16K × 8 16KX8 16K × 8
surface mount YES YES YES YES Yes YES Yes
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form BALL GULL WING GULL WING NO LEAD GULL WING BALL GULL WING
Terminal location BOTTOM DUAL DUAL DUAL pair BOTTOM pair
Is it Rohs certified? conform to conform to conform to conform to - conform to -
Parts packaging code BGA TSSOP TSSOP SON - BGA -
package instruction VFBGA, BGA8,2X4,30 TSSOP, TSSOP8,.25 TSSOP, TSSOP8,.25 VSON, SOLCC8,.11,20 - VFBGA, BGA8,2X4,30 -
Contacts 8 8 8 8 - 8 -
Reach Compliance Code compli compli compli compli - compli -
ECCN code EAR99 EAR99 EAR99 EAR99 - EAR99 -
Maximum clock frequency (fCLK) 20 MHz 5 MHz 5 MHz 5 MHz - 5 MHz -
Data retention time - minimum 100 100 100 100 - 100 -
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles - 1000000 Write/Erase Cycles -
JESD-30 code R-PBGA-B8 R-PDSO-G8 R-PDSO-G8 R-PDSO-N8 - R-PBGA-B8 -
JESD-609 code e3 e4 e4 e4 - e3 -
length 3.73 mm 4.4 mm 4.4 mm 3 mm - 3.73 mm -
memory density 262144 bi 262144 bi 262144 bi 262144 bi - 131072 bi -
Memory IC Type EEPROM EEPROM EEPROM EEPROM - EEPROM -
word count 32768 words 32768 words 32768 words 32768 words - 16384 words -
character code 32000 32000 32000 32000 - 16000 -
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY -
encapsulated code VFBGA TSSOP TSSOP VSON - VFBGA -
Encapsulate equivalent code BGA8,2X4,30 TSSOP8,.25 TSSOP8,.25 SOLCC8,.11,20 - BGA8,2X4,30 -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR -
Package form GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE - GRID ARRAY, VERY THIN PROFILE, FINE PITCH -
Parallel/Serial SERIAL SERIAL SERIAL SERIAL - SERIAL -
power supply 2/5 V 2/5 V 2/5 V 2/5 V - 2/5 V -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified -
Maximum seat height 1 mm 1.2 mm 1.2 mm 0.6 mm - 1 mm -
Serial bus type SPI SPI SPI SPI - SPI -
Maximum standby current 0.000003 A 0.000003 A 0.000003 A 0.000003 A - 0.000003 A -
Maximum slew rate 0.01 mA 0.01 mA 0.01 mA 0.01 mA - 0.01 mA -
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V - 5.5 V -
Minimum supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V - 1.8 V -
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V - 2.5 V -
technology CMOS CMOS CMOS CMOS - CMOS -
Terminal surface MATTE TIN Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD - MATTE TIN -
Terminal pitch 0.75 mm 0.65 mm 0.65 mm 0.5 mm - 0.75 mm -
width 2.35 mm 3 mm 3 mm 2 mm - 2.35 mm -
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms - 5 ms -
write protect HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE - HARDWARE/SOFTWARE -

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