NM27C010VE100 datasheet, PDF - EEWORLD Datasheet

NM27C010VE100: DescriptionOTP ROM, 128KX8, 100ns, CMOS, PQCC32,; Categorystorage storage; File Size599KB，12 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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NM27C010VE100 Overview

OTP ROM, 128KX8, 100ns, CMOS, PQCC32,

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Fairchild
package instruction	QCCJ, LDCC32,.5X.6
Reach Compliance Code	unknown
Maximum access time	100 ns
I/O type	COMMON
JESD-30 code	R-PQCC-J32
JESD-609 code	e0
memory density	1048576 bit
memory width	8
Number of terminals	32
word count	131072 words
character code	128000
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC32,.5X.6
Package shape	RECTANGULAR
Package form	CHIP CARRIER
power supply	5 V
Certification status	Not Qualified
Maximum standby current	0.0001 A
Maximum slew rate	0.03 mA
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD

	NM27C010VE100	NM27C010QM150	NM27C010QE100
Description	OTP ROM, 128KX8, 100ns, CMOS, PQCC32,	UVPROM, 128KX8, 150ns, CMOS, CDIP32,	EPROM, 128KX8, 100ns, CMOS, CDIP32,
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Fairchild	Fairchild	Fairchild
Reach Compliance Code	unknown	compliant	unknown
Maximum access time	100 ns	150 ns	100 ns
I/O type	COMMON	COMMON	COMMON
JESD-30 code	R-PQCC-J32	R-XDIP-T32	R-XDIP-T32
JESD-609 code	e0	e0	e0
memory density	1048576 bit	1048576 bit	1048576 bit
memory width	8	8	8
Number of terminals	32	32	32
word count	131072 words	131072 words	131072 words
character code	128000	128000	128000
Maximum operating temperature	85 °C	125 °C	85 °C
Minimum operating temperature	-40 °C	-55 °C	-40 °C
organize	128KX8	128KX8	128KX8
Output characteristics	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	QCCJ	DIP	DIP
Encapsulate equivalent code	LDCC32,.5X.6	DIP32,.6	DIP32,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum standby current	0.0001 A	0.0001 A	0.0001 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	YES	NO	NO
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	MILITARY	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL
package instruction	QCCJ, LDCC32,.5X.6	-	DIP, DIP32,.6

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

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