SLIC, CMOS, PQFP64, MS-026ACD-HD, TQFP-64
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Silicon Laboratories Inc |
Parts packaging code | QFP |
package instruction | TFQFP, |
Contacts | 64 |
Reach Compliance Code | unknown |
JESD-30 code | S-PQFP-G64 |
JESD-609 code | e0 |
length | 10 mm |
Number of functions | 1 |
Number of terminals | 64 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | TFQFP |
Package shape | SQUARE |
Package form | FLATPACK, THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 240 |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Nominal supply voltage | 3.3 V |
surface mount | YES |
technology | CMOS |
Telecom integrated circuit types | SLIC |
Temperature level | INDUSTRIAL |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 30 |
width | 10 mm |
SI3232-BQR | SI3232-BQ | SI3232-KQ | SI3232-KQR | SI3200-BS | SI3200-BSR | SI3200-KS | SI3200-KSR | |
---|---|---|---|---|---|---|---|---|
Description | SLIC, CMOS, PQFP64, MS-026ACD-HD, TQFP-64 | SLIC, CMOS, PQFP64, MS-026ACD-HD, TQFP-64 | SLIC, CMOS, PQFP64, MS-026ACD-HD, TQFP-64 | SLIC, CMOS, PQFP64, MS-026ACD-HD, TQFP-64 | SLIC, CMOS, PDSO16, SOIC-16 | SLIC, CMOS, PDSO16, SOIC-16 | SLIC, CMOS, PDSO16, SOIC-16 | SLIC, CMOS, PDSO16, SOIC-16 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc |
Parts packaging code | QFP | QFP | QFP | QFP | SOIC | SOIC | SOIC | SOIC |
package instruction | TFQFP, | TFQFP, | TFQFP, | TFQFP, | HSOP, SOP16,.25 | HSOP, SOP16,.25 | HSOP, SOP16,.25 | HSOP, SOP16,.25 |
Contacts | 64 | 64 | 64 | 64 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 10 mm | 10 mm | 10 mm | 10 mm | 9.9 mm | 9.9 mm | 9.9 mm | 9.9 mm |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 64 | 64 | 64 | 64 | 16 | 16 | 16 | 16 |
Maximum operating temperature | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TFQFP | TFQFP | TFQFP | TFQFP | HSOP | HSOP | HSOP | HSOP |
Package shape | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | SMALL OUTLINE, HEAT SINK/SLUG | SMALL OUTLINE, HEAT SINK/SLUG | SMALL OUTLINE, HEAT SINK/SLUG | SMALL OUTLINE, HEAT SINK/SLUG |
Peak Reflow Temperature (Celsius) | 240 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Telecom integrated circuit types | SLIC | SLIC | SLIC | SLIC | SLIC | SLIC | SLIC | SLIC |
Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | QUAD | QUAD | QUAD | QUAD | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
width | 10 mm | 10 mm | 10 mm | 10 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |