DDR DRAM, 32MX8, 0.75ns, CMOS, PBGA60, FBGA-60
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | SK Hynix |
Parts packaging code | BGA |
package instruction | TBGA, BGA60,9X12,40/32 |
Contacts | 60 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FOUR BANK PAGE BURST |
Maximum access time | 0.75 ns |
Other features | AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) | 133 MHz |
I/O type | COMMON |
interleaved burst length | 2,4,8 |
JESD-30 code | R-PBGA-B60 |
length | 13.5 mm |
memory density | 268435456 bit |
Memory IC Type | DDR DRAM |
memory width | 8 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 60 |
word count | 33554432 words |
character code | 32000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 32MX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TBGA |
Encapsulate equivalent code | BGA60,9X12,40/32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 2.5 V |
Certification status | Not Qualified |
refresh cycle | 8192 |
Maximum seat height | 1.17 mm |
self refresh | YES |
Continuous burst length | 2,4,8 |
Maximum standby current | 0.02 A |
Maximum slew rate | 0.305 mA |
Maximum supply voltage (Vsup) | 2.7 V |
Minimum supply voltage (Vsup) | 2.3 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 8.5 mm |