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K9K1G08B0B-GIB00

Description
Flash, 128MX8, 30ns, PBGA63, FBGA-63
Categorystorage    storage   
File Size1MB,41 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K9K1G08B0B-GIB00 Overview

Flash, 128MX8, 30ns, PBGA63, FBGA-63

K9K1G08B0B-GIB00 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSAMSUNG
Parts packaging codeBGA
package instructionTFBGA, BGA63,10X12,32
Contacts63
Reach Compliance Codecompliant
ECCN code3A991.B.1.A
Maximum access time30 ns
command user interfaceYES
Data pollingNO
JESD-30 codeR-PBGA-B63
length13.5 mm
memory density1073741824 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of departments/size8K
Number of terminals63
word count134217728 words
character code128000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Encapsulate equivalent codeBGA63,10X12,32
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
page size512 words
Parallel/SerialPARALLEL
power supply2.7 V
Programming voltage2.7 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size16K
Maximum standby current0.00005 A
Maximum slew rate0.02 mA
Maximum supply voltage (Vsup)2.9 V
Minimum supply voltage (Vsup)2.5 V
Nominal supply voltage (Vsup)2.7 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
switch bitNO
typeSLC NAND TYPE
width8.5 mm
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