Synchronous DRAM Module, 16MX72, 5.4ns, CMOS, SODIMM-144
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | SK Hynix |
Parts packaging code | MODULE |
package instruction | DIMM, DIMM144,32 |
Contacts | 144 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | SINGLE BANK PAGE BURST |
Maximum access time | 5.4 ns |
Other features | AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) | 133 MHz |
I/O type | COMMON |
JESD-30 code | R-XDMA-N144 |
memory density | 1207959552 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE |
memory width | 72 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 144 |
word count | 16777216 words |
character code | 16000000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 16MX72 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Encapsulate equivalent code | DIMM144,32 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 8192 |
self refresh | YES |
Maximum standby current | 0.008 A |
Maximum slew rate | 0.88 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 0.8 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
HYM72V16M736BT6-H | HYM72V16M736BLT6-K | HYM72V16M736BT6-K | |
---|---|---|---|
Description | Synchronous DRAM Module, 16MX72, 5.4ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX72, 5.4ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX72, 5.4ns, CMOS, SODIMM-144 |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Maker | SK Hynix | SK Hynix | SK Hynix |
Parts packaging code | MODULE | MODULE | MODULE |
package instruction | DIMM, DIMM144,32 | DIMM, DIMM144(UNSPEC) | DIMM, DIMM144(UNSPEC) |
Contacts | 144 | 144 | 144 |
Reach Compliance Code | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 |
access mode | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST | SINGLE BANK PAGE BURST |
Maximum access time | 5.4 ns | 5.4 ns | 5.4 ns |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
Maximum clock frequency (fCLK) | 133 MHz | 133 MHz | 133 MHz |
I/O type | COMMON | COMMON | COMMON |
JESD-30 code | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 |
memory density | 1207959552 bit | 1207959552 bit | 1207959552 bit |
Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
memory width | 72 | 72 | 72 |
Number of functions | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 |
Number of terminals | 144 | 144 | 144 |
word count | 16777216 words | 16777216 words | 16777216 words |
character code | 16000000 | 16000000 | 16000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
organize | 16MX72 | 16MX72 | 16MX72 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIMM | DIMM | DIMM |
Encapsulate equivalent code | DIMM144,32 | DIMM144(UNSPEC) | DIMM144(UNSPEC) |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
power supply | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 8192 | 8192 | 8192 |
self refresh | YES | YES | YES |
Maximum standby current | 0.008 A | 0.008 A | 0.008 A |
Maximum slew rate | 0.88 mA | 0.88 mA | 0.88 mA |
Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V |
Minimum supply voltage (Vsup) | 3 V | 3 V | 3 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | NO | NO |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD |
Terminal location | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |