SI3209-B-GM datasheet, PDF - EEWORLD Datasheet

SI3209-B-GM: DescriptionSLIC, ROHS COMPLIANT, MS-220VJJD-2, QFN-40; CategoryWireless rf/communication Telecom circuit; File Size666KB，38 Pages; ManufacturerSilicon Laboratories Inc; Environmental Compliance

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SLIC, ROHS COMPLIANT, MS-220VJJD-2, QFN-40

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Silicon Laboratories Inc
Parts packaging code	QFN
package instruction	HVQCCN,
Contacts	40
Reach Compliance Code	unknown
JESD-30 code	S-XQCC-N40
length	6 mm
Number of functions	1
Number of terminals	40
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1 mm
Nominal supply voltage	3.3 V
surface mount	YES
Telecom integrated circuit types	SLIC
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	6 mm

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