256X8 SPI BUS SERIAL EEPROM, PDIP8, PLASTIC, DIP-8
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | ON Semiconductor |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum clock frequency (fCLK) | 1 MHz |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| length | 9.36 mm |
| memory density | 2048 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 256 words |
| character code | 256 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256X8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 240 |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Serial bus type | SPI |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 1.8 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| width | 7.62 mm |
| Maximum write cycle time (tWC) | 5 ms |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD