Parameter Name | Attribute value |
Source Url Status Check Date | 2013-06-14 00:00:00 |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | NXP |
Parts packaging code | SON |
package instruction | VSON, SOLCC6,.04,14 |
Contacts | 6 |
Reach Compliance Code | compli |
series | LVC/LCX/Z |
JESD-30 code | S-PDSO-N6 |
JESD-609 code | e3 |
length | 1 mm |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | NAND GATE |
MaximumI(ol) | 0.024 A |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of entries | 2 |
Number of terminals | 6 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | VSON |
Encapsulate equivalent code | SOLCC6,.04,14 |
Package shape | SQUARE |
Package form | SMALL OUTLINE, VERY THIN PROFILE |
method of packing | TAPE AND REEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 3.3 V |
Prop。Delay @ Nom-Su | 6 ns |
propagation delay (tpd) | 10.5 ns |
Certification status | Not Qualified |
Schmitt trigger | NO |
Maximum seat height | 0.5 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 1.65 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal surface | Tin (Sn) |
Terminal form | NO LEAD |
Terminal pitch | 0.35 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 30 |
width | 1 mm |
Base Number Matches | 1 |