IC,BUFFER/DRIVER,SINGLE,6-BIT,LS-TTL,DIP,16PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NXP |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
Control type | ENABLE LOW |
JESD-30 code | R-PDIP-T16 |
JESD-609 code | e0 |
Logic integrated circuit type | BUS DRIVER |
MaximumI(ol) | 0.024 A |
Number of digits | 6 |
Number of functions | 1 |
Number of terminals | 16 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output characteristics | 3-STATE |
Output polarity | INVERTED |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Maximum supply current (ICC) | 21 mA |
Prop。Delay @ Nom-Sup | 18 ns |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
SN74LS366AN | SN74LS366AD | SN74LS366AND | SN74LS366AJDS | |
---|---|---|---|---|
Description | IC,BUFFER/DRIVER,SINGLE,6-BIT,LS-TTL,DIP,16PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,6-BIT,LS-TTL,SOP,16PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,6-BIT,LS-TTL,DIP,16PIN,PLASTIC | IC,BUFFER/DRIVER,SINGLE,6-BIT,LS-TTL,DIP,16PIN,CERAMIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
Maker | NXP | NXP | NXP | NXP |
package instruction | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
JESD-30 code | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-XDIP-T16 |
JESD-609 code | e0 | e0 | e0 | e0 |
Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
MaximumI(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
Number of digits | 6 | 6 | 6 | 6 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 16 | 16 | 16 | 16 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Output polarity | INVERTED | INVERTED | INVERTED | INVERTED |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC |
encapsulated code | DIP | SOP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | SOP16,.25 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | NO | NO |
technology | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |
Maximum supply current (ICC) | 21 mA | 21 mA | 21 mA | - |
Prop。Delay @ Nom-Sup | 18 ns | 18 ns | 18 ns | - |