Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon, TSFP-3
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | Infineon |
package instruction | SMALL OUTLINE, R-PDSO-F3 |
Reach Compliance Code | compliant |
Factory Lead Time | 1 week |
Other features | BUILT-IN BIAS RESISTOR |
Maximum collector current (IC) | 0.1 A |
Collector-emitter maximum voltage | 50 V |
Configuration | SINGLE WITH BUILT-IN RESISTOR |
Minimum DC current gain (hFE) | 120 |
JESD-30 code | R-PDSO-F3 |
Number of components | 1 |
Number of terminals | 3 |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Polarity/channel type | NPN |
surface mount | YES |
Terminal form | FLAT |
Terminal location | DUAL |
transistor applications | SWITCHING |
Transistor component materials | SILICON |
Nominal transition frequency (fT) | 150 MHz |
BCR129FE6327 | BCR129SE6327 | BCR129WE6327 | |
---|---|---|---|
Description | Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon, TSFP-3 | Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 2-Element, NPN, Silicon, SOT-363, 6 PIN | Small Signal Bipolar Transistor, 0.1A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon, SOT-323, 3 PIN |
Is it Rohs certified? | conform to | conform to | conform to |
Maker | Infineon | Infineon | Infineon |
package instruction | SMALL OUTLINE, R-PDSO-F3 | SMALL OUTLINE, R-PDSO-G6 | SMALL OUTLINE, R-PDSO-G3 |
Reach Compliance Code | compliant | compliant | compliant |
Other features | BUILT-IN BIAS RESISTOR | BUILT-IN BIAS RESISTOR | BUILT-IN BIAS RESISTOR |
Maximum collector current (IC) | 0.1 A | 0.1 A | 0.1 A |
Collector-emitter maximum voltage | 50 V | 50 V | 50 V |
Configuration | SINGLE WITH BUILT-IN RESISTOR | SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR | SINGLE WITH BUILT-IN RESISTOR |
Minimum DC current gain (hFE) | 120 | 120 | 120 |
JESD-30 code | R-PDSO-F3 | R-PDSO-G6 | R-PDSO-G3 |
Number of components | 1 | 2 | 1 |
Number of terminals | 3 | 6 | 3 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Polarity/channel type | NPN | NPN | NPN |
surface mount | YES | YES | YES |
Terminal form | FLAT | GULL WING | GULL WING |
Terminal location | DUAL | DUAL | DUAL |
transistor applications | SWITCHING | SWITCHING | SWITCHING |
Transistor component materials | SILICON | SILICON | SILICON |
Nominal transition frequency (fT) | 150 MHz | 150 MHz | 150 MHz |
Humidity sensitivity level | - | 1 | 1 |
Maximum operating temperature | - | 150 °C | 150 °C |