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MC68HC05J5CJP

Description
8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PDIP16, PLASTIC, DIP-16
CategoryThe embedded processor and controller    Microcontrollers and processors   
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MC68HC05J5CJP Overview

8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PDIP16, PLASTIC, DIP-16

MC68HC05J5CJP Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeDIP
package instructionDIP,
Contacts16
Reach Compliance Codeunknown
Has ADCNO
Address bus width
bit size8
maximum clock frequency4.2 MHz
DAC channelNO
DMA channelNO
External data bus width
JESD-30 codeR-PDIP-T16
length19.175 mm
Number of I/O lines10
Number of terminals16
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
ROM programmabilityMROM
Maximum seat height4.44 mm
speed2.1 MHz
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountNO
technologyHCMOS
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width7.62 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER

MC68HC05J5CJP Related Products

MC68HC05J5CJP MC68HC05J5CJDW MC68HC05J5JP MC68HC05J5P
Description 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PDIP16, PLASTIC, DIP-16 Microcontroller, 8-Bit, MROM, 2.1MHz, HCMOS, PDSO16, SOIC-16 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PDIP16, PLASTIC, DIP-16 8-BIT, MROM, 2.1MHz, MICROCONTROLLER, PDIP20, PLASTIC, DIP-20
package instruction DIP, SOP, DIP, DIP16,.3 DIP, DIP20,.3
Reach Compliance Code unknown unknown unknown unknown
Has ADC NO NO NO NO
bit size 8 8 8 8
maximum clock frequency 4.2 MHz 4.2 MHz 4.2 MHz 4.2 MHz
DAC channel NO NO NO NO
DMA channel NO NO NO NO
JESD-30 code R-PDIP-T16 R-PDSO-G16 R-PDIP-T16 R-PDIP-T20
length 19.175 mm 10.3 mm 19.175 mm 26.415 mm
Number of I/O lines 10 10 10 14
Number of terminals 16 16 16 20
Maximum operating temperature 85 °C 85 °C 70 °C 70 °C
PWM channel NO NO NO NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
ROM programmability MROM MROM MROM MROM
Maximum seat height 4.44 mm 2.65 mm 4.44 mm 4.57 mm
speed 2.1 MHz 2.1 MHz 2.1 MHz 2.1 MHz
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount NO YES NO NO
technology HCMOS HCMOS HCMOS HCMOS
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE GULL WING THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL
width 7.62 mm 7.5 mm 7.62 mm 7.62 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
Maker Motorola ( NXP ) - Motorola ( NXP ) Motorola ( NXP )
Parts packaging code DIP - DIP DIP
Contacts 16 - 16 20
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