Memory Circuit, Flash+PSRAM, CMOS, PBGA73
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | AMD |
package instruction | FBGA, BGA73,10X12,32 |
Reach Compliance Code | compliant |
Maximum access time | 70 ns |
JESD-30 code | R-PBGA-B73 |
JESD-609 code | e0 |
Memory IC Type | MEMORY CIRCUIT |
Mixed memory types | FLASH+PSRAM |
Number of terminals | 73 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | FBGA |
Encapsulate equivalent code | BGA73,10X12,32 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, FINE PITCH |
power supply | 3 V |
Certification status | Not Qualified |
Maximum standby current | 0.000005 A |
Maximum slew rate | 0.04 mA |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Base Number Matches | 1 |