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71V3557S75BQGI

Description
ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165
Categorystorage    storage   
File Size491KB,26 Pages
ManufacturerIDT (Integrated Device Technology)
Environmental Compliance  
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71V3557S75BQGI Overview

ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165

71V3557S75BQGI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerIDT (Integrated Device Technology)
Parts packaging codeBGA
package instructionTBGA,
Contacts165
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time7.5 ns
JESD-30 codeR-PBGA-B165
JESD-609 codee1
length15 mm
memory density4718592 bit
Memory IC TypeZBT SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals165
word count131072 words
character code128000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize128KX36
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width13 mm
Base Number Matches1

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Description ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 256KX18, 7.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 ZBT SRAM, 256KX18, 7.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 ZBT SRAM, 256KX18, 7.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 ZBT SRAM, 256KX18, 7.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 ZBT SRAM, 256KX18, 7.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119
Is it lead-free? Lead free Contains lead Lead free Lead free Lead free Lead free Contains lead Lead free Lead free Lead free
Is it Rohs certified? conform to incompatible conform to conform to conform to conform to incompatible conform to conform to conform to
Parts packaging code BGA BGA BGA BGA BGA BGA BGA BGA BGA BGA
package instruction TBGA, TBGA, BGA, BGA, TBGA, TBGA, BGA, TBGA, BGA, BGA,
Contacts 165 165 119 119 165 165 119 165 119 119
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 7.5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns 7.5 ns
JESD-30 code R-PBGA-B165 R-PBGA-B165 R-PBGA-B119 R-PBGA-B119 R-PBGA-B165 R-PBGA-B165 R-PBGA-B119 R-PBGA-B165 R-PBGA-B119 R-PBGA-B119
JESD-609 code e1 e0 e1 e1 e1 e1 e0 e1 e1 e1
length 15 mm 15 mm 22 mm 22 mm 15 mm 15 mm 22 mm 15 mm 22 mm 22 mm
memory density 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit 4718592 bit
Memory IC Type ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM ZBT SRAM
memory width 36 36 36 36 18 18 18 36 18 18
Humidity sensitivity level 3 3 3 3 3 3 3 3 3 3
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 165 165 119 119 165 165 119 165 119 119
word count 131072 words 131072 words 131072 words 131072 words 262144 words 262144 words 262144 words 131072 words 262144 words 262144 words
character code 128000 128000 128000 128000 256000 256000 256000 128000 256000 256000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
organize 128KX36 128KX36 128KX36 128KX36 256KX18 256KX18 256KX18 128KX36 256KX18 256KX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TBGA TBGA BGA BGA TBGA TBGA BGA TBGA BGA BGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY GRID ARRAY GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY GRID ARRAY, THIN PROFILE GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) 260 225 260 260 260 260 225 260 260 260
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 2.36 mm 2.36 mm 1.2 mm 1.2 mm 2.36 mm 1.2 mm 2.36 mm 2.36 mm
Maximum supply voltage (Vsup) 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V 3.465 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN SILVER COPPER TIN LEAD TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN LEAD TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL BALL BALL
Terminal pitch 1 mm 1 mm 1.27 mm 1.27 mm 1 mm 1 mm 1.27 mm 1 mm 1.27 mm 1.27 mm
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
Maximum time at peak reflow temperature 30 20 30 30 30 30 20 30 30 30
width 13 mm 13 mm 14 mm 14 mm 13 mm 13 mm 14 mm 13 mm 14 mm 14 mm
Base Number Matches 1 1 1 1 1 1 1 1 1 1
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)

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