ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | BGA |
package instruction | TBGA, |
Contacts | 165 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Maximum access time | 7.5 ns |
JESD-30 code | R-PBGA-B165 |
JESD-609 code | e1 |
length | 15 mm |
memory density | 4718592 bit |
Memory IC Type | ZBT SRAM |
memory width | 36 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 165 |
word count | 131072 words |
character code | 128000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 128KX36 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 1.2 mm |
Maximum supply voltage (Vsup) | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 13 mm |
Base Number Matches | 1 |
71V3557S75BQGI | 71V3557S75BQI | IDT71V3557S75BGGI | 71V3557S75BGGI | 71V3559S75BQGI | IDT71V3559S75BQGI | 71V3559S75BGI | IDT71V3557S75BQGI | 71V3559S75BGGI | IDT71V3559S75BGGI | |
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Description | ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 | ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 | ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | ZBT SRAM, 256KX18, 7.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 | ZBT SRAM, 256KX18, 7.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 | ZBT SRAM, 256KX18, 7.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | ZBT SRAM, 128KX36, 7.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 | ZBT SRAM, 256KX18, 7.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | ZBT SRAM, 256KX18, 7.5ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 |
Is it lead-free? | Lead free | Contains lead | Lead free | Lead free | Lead free | Lead free | Contains lead | Lead free | Lead free | Lead free |
Is it Rohs certified? | conform to | incompatible | conform to | conform to | conform to | conform to | incompatible | conform to | conform to | conform to |
Parts packaging code | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
package instruction | TBGA, | TBGA, | BGA, | BGA, | TBGA, | TBGA, | BGA, | TBGA, | BGA, | BGA, |
Contacts | 165 | 165 | 119 | 119 | 165 | 165 | 119 | 165 | 119 | 119 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
Maximum access time | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns | 7.5 ns |
JESD-30 code | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B119 | R-PBGA-B119 | R-PBGA-B165 | R-PBGA-B165 | R-PBGA-B119 | R-PBGA-B165 | R-PBGA-B119 | R-PBGA-B119 |
JESD-609 code | e1 | e0 | e1 | e1 | e1 | e1 | e0 | e1 | e1 | e1 |
length | 15 mm | 15 mm | 22 mm | 22 mm | 15 mm | 15 mm | 22 mm | 15 mm | 22 mm | 22 mm |
memory density | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit | 4718592 bit |
Memory IC Type | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM | ZBT SRAM |
memory width | 36 | 36 | 36 | 36 | 18 | 18 | 18 | 36 | 18 | 18 |
Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 165 | 165 | 119 | 119 | 165 | 165 | 119 | 165 | 119 | 119 |
word count | 131072 words | 131072 words | 131072 words | 131072 words | 262144 words | 262144 words | 262144 words | 131072 words | 262144 words | 262144 words |
character code | 128000 | 128000 | 128000 | 128000 | 256000 | 256000 | 256000 | 128000 | 256000 | 256000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 128KX36 | 128KX36 | 128KX36 | 128KX36 | 256KX18 | 256KX18 | 256KX18 | 128KX36 | 256KX18 | 256KX18 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TBGA | TBGA | BGA | BGA | TBGA | TBGA | BGA | TBGA | BGA | BGA |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY | GRID ARRAY | GRID ARRAY, THIN PROFILE | GRID ARRAY, THIN PROFILE | GRID ARRAY | GRID ARRAY, THIN PROFILE | GRID ARRAY | GRID ARRAY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 | 225 | 260 | 260 | 260 | 260 | 225 | 260 | 260 | 260 |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.2 mm | 1.2 mm | 2.36 mm | 2.36 mm | 1.2 mm | 1.2 mm | 2.36 mm | 1.2 mm | 2.36 mm | 2.36 mm |
Maximum supply voltage (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
Minimum supply voltage (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | TIN SILVER COPPER | TIN LEAD | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN LEAD | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 1 mm | 1 mm | 1.27 mm | 1.27 mm | 1 mm | 1 mm | 1.27 mm | 1 mm | 1.27 mm | 1.27 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | 30 | 20 | 30 | 30 | 30 | 30 | 20 | 30 | 30 | 30 |
width | 13 mm | 13 mm | 14 mm | 14 mm | 13 mm | 13 mm | 14 mm | 13 mm | 14 mm | 14 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |