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PDF Solutions, founded in Silicon Valley in 1991, has been focusing on one thing for the past 30 years - helping the entire semiconductor industry chain to tap into data value. So far, the company's ...[Details]
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Beijing time, June 1st morning news, Reuters quoted the Nihon Keizai Shimbun as reporting that about 20 Japanese companies, including electronic component manufacturer Ibiden Co., Ltd. (IBIDEN), will...[Details]
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In the past, it was hard to get a chip, and the price changed every day, rising rapidly; Today, the price of some chips is only one-tenth of the highest price. The prices of some chips have rec...[Details]
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Analyst Ming-Chi Kuo tweeted, "My latest research shows that TSMC will be the exclusive supplier of Qualcomm's 5G flagship chips in 2023 and 2024, which is a super win-win situation for both companie...[Details]
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After losing a patent licensing case against chip supplier Qualcomm, several automakers including Tesla, Ford, Honda and Daimler, as well as technology companies such as Intel and MediaTek, jointly u...[Details]
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On April 14, according to Taiwanese media reports, TSMC Fab 14 experienced an unexpected power outage this afternoon! The amount of loss is within NT$1 billion! TSMC said that the power outage was ...[Details]
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Recently, ROHM Semiconductor held a media salon on the theme of SiC power devices in Beijing. As one of the earliest manufacturers to mass-produce SiC power components, ROHM successfully mass-produce...[Details]
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Over the past few years, the industry has become accustomed to increasing supply chain challenges, such as component shortages. These challenges create many problems for various industries that rely ...[Details]
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Changdian Technology releases XDFOITM multi-dimensional advanced packaging technology, providing a full range of solutions for high-density heterogeneous integration
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Infineon will build the world's largest 200mm silicon carbide power semiconductor wafer fab in Kulim, Malaysia. Total revenue is expected to reach approximately 7 billion euros by the end of 2030. ...[Details]
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Morse Microelectronics received a total of A$30 million in additional financing from Australian pension funds and other funds in Series B financing Investments from Telstra Super, Hesta, Hostplus, ...[Details]
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The 7nm process currently used for Apple A12, Snapdragon 855, and Kirin 980 is TSMC's first generation, and the second-generation 7nm with more advanced technology and integrated EUV lithography tech...[Details]
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On April 24th, local time in the United States, TSMC held the "2024 TSMC North American Technology Forum" in the United States, disclosing its latest process technology, advanced packaging technolo...[Details]
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Recently, Arm announced the launch of the 2023 Total Compute Solution (TCS23). TCS23 provides a complete set of the latest IPs designed and optimized for specific workloads, including the latest CP...[Details]
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China's integrated circuit design industry has made great progress in the past decade. This is not only reflected in the emergence of a large number of successful chip design companies in the indus...[Details]