Small Signal Bipolar Transistor, 0.1A I(C), 200V V(BR)CEO, 1-Element, NPN, Silicon, MINI MOLD PACKAGE-3
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | NEC Electronics |
package instruction | SMALL OUTLINE, R-PDSO-G3 |
Contacts | 3 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Maximum collector current (IC) | 0.1 A |
Collector-emitter maximum voltage | 200 V |
Configuration | SINGLE |
Minimum DC current gain (hFE) | 135 |
JESD-30 code | R-PDSO-G3 |
JESD-609 code | e0 |
Number of components | 1 |
Number of terminals | 3 |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | NPN |
Certification status | Not Qualified |
surface mount | YES |
Terminal surface | TIN LEAD |
Terminal form | GULL WING |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
transistor applications | SWITCHING |
Transistor component materials | SILICON |
Nominal transition frequency (fT) | 160 MHz |
Maximum off time (toff) | 1600 ns |
Maximum opening time (tons) | 150 ns |
Base Number Matches | 1 |
2SC3360-N16 | 2SC3360-N17 | 2SC3360-N15 | |
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Description | Small Signal Bipolar Transistor, 0.1A I(C), 200V V(BR)CEO, 1-Element, NPN, Silicon, MINI MOLD PACKAGE-3 | Small Signal Bipolar Transistor, 0.1A I(C), 200V V(BR)CEO, 1-Element, NPN, Silicon, MINI MOLD PACKAGE-3 | Small Signal Bipolar Transistor, 0.1A I(C), 200V V(BR)CEO, 1-Element, NPN, Silicon, MINI MOLD PACKAGE-3 |
Is it Rohs certified? | incompatible | incompatible | incompatible |
Maker | NEC Electronics | NEC Electronics | NEC Electronics |
package instruction | SMALL OUTLINE, R-PDSO-G3 | SMALL OUTLINE, R-PDSO-G3 | SMALL OUTLINE, R-PDSO-G3 |
Contacts | 3 | 3 | 3 |
Reach Compliance Code | compliant | compliant | compliant |
ECCN code | EAR99 | EAR99 | EAR99 |
Maximum collector current (IC) | 0.1 A | 0.1 A | 0.1 A |
Collector-emitter maximum voltage | 200 V | 200 V | 200 V |
Configuration | SINGLE | SINGLE | SINGLE |
Minimum DC current gain (hFE) | 135 | 200 | 90 |
JESD-30 code | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 |
JESD-609 code | e0 | e0 | e0 |
Number of components | 1 | 1 | 1 |
Number of terminals | 3 | 3 | 3 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Polarity/channel type | NPN | NPN | NPN |
Certification status | Not Qualified | Not Qualified | Not Qualified |
surface mount | YES | YES | YES |
Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD |
Terminal form | GULL WING | GULL WING | GULL WING |
Terminal location | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
transistor applications | SWITCHING | SWITCHING | SWITCHING |
Transistor component materials | SILICON | SILICON | SILICON |
Nominal transition frequency (fT) | 160 MHz | 160 MHz | 160 MHz |
Maximum off time (toff) | 1600 ns | 1600 ns | 1600 ns |
Maximum opening time (tons) | 150 ns | 150 ns | 150 ns |
Base Number Matches | 1 | 1 | 1 |