SPECIFICATIONS
FUTURE BUS CONNECTOR
1F Series
Header Sol der Type
2.0mm Pitch
4 Row s
Mechanical
Contact Retention Force:
1.0Kg min.
Electrical
Voltage Rating:
750V
Current Rating:
1A
Contact Resistance:
45m
Ω
max.
Dielectrical Withstanding Voltage:
1000V
Insulation Resistance:
1000M
Ω
min.
Physical
Housing:
LCP, UL 94-0 rated, Ivory White
Contact:
Phosphor Bronze
Plating:
See “ORDERING INFORMATION”
DRAWING
ORDERING I NF OR MATI ON
P A R T
1 F 1 1 0 2 4
POS. NO.
024: 24POS.
PLATING SPEC.
1:GOLD FLASH
3:0.76um(30u")MIN. GOLD PLATING
5:1.27um(50u")MIN. GOLD PLATING
6:0.25um(10u")MIN. GOLD PLATING
A:0.76um(30u")MIN. FPT PLATING,
0.25um(10u")MIN. GOLD INCLUDED.
TAIL STYLE
S: SOLDER TYPE
*
- S
L
*
I S T
* C 0
*
-
*
*
LEAD FREE CODE
N:NONE
F:LEAD FREE PLATING
PACKAGE TYPE
A:TUBE
EXTENSION CODE
N, T, L, M
BODY STYLE
SELECTIVE PIN PATTERN
(DETAIL PLEASE REFER TO
CUSTOMER DRAWING)
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
Foxconn Electronics Inc.-- Products Browse by Pitch
Backplane Connector -> Future Bus 2mm Conn
Future Bus 2mm Conn 4Row Power Header:
1F11024A-S01CST-AF
1F Series Header, Solder Type 2.0mm Pitch 4 Rows
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Feature
Number of Positions:
24
PCB Mount Style:
R/A
Attribute
Part Number
Enter Part Number
Starts With
Contains
Exact Match
Plating:
0.76um(30u") MIN. FPT
PLATING
Color:
White
Number Row:
4
Solder Tail Type:
Solder
Packaging Method:
Tube
Available Status:
Active
RoHS Status:
RoHS-6
Business Unit:
CID
Lead-Time ( Week ):
4
MOQ ( pc ):
1728
Notice: Please confirm part availability with your local account manager.
http://www.foxconn.com/NWInG/Search/Product_...r&P_PN=1F11024A%2DS01CST%2DAF&searchTypeID=3 [21-May-2008 12:01:49 PM]