|
ADC0881CCJ |
ADC0881CCV |
ADC0881CCN |
Description |
8-BIT FLASH METHOD ADC, PARALLEL ACCESS, CDIP28, CERDIP-28 |
8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PQCC28, PLASTIC, LCC-28 |
8-BIT FLASH METHOD ADC, PARALLEL ACCESS, PDIP28 |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
package instruction |
DIP, DIP28,.6 |
QCCJ, LDCC28,.5SQ |
DIP, DIP28,.6 |
Reach Compliance Code |
unknown |
unknown |
unknown |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
Maximum analog input voltage |
7.5 V |
7.5 V |
7.5 V |
Minimum analog input voltage |
-0.5 V |
-0.5 V |
-0.5 V |
Converter type |
ADC, FLASH METHOD |
ADC, FLASH METHOD |
ADC, FLASH METHOD |
JESD-30 code |
R-GDIP-T28 |
S-PQCC-J28 |
R-PDIP-T28 |
JESD-609 code |
e0 |
e0 |
e0 |
length |
36.83 mm |
11.43 mm |
35.725 mm |
Maximum linear error (EL) |
0.2% |
0.2% |
0.2% |
Number of digits |
8 |
8 |
8 |
Number of functions |
1 |
1 |
1 |
Number of terminals |
28 |
28 |
28 |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
Output bit code |
BINARY, COMPLEMENTARY 2'S COMPLEMENT |
BINARY, COMPLEMENTARY 2'S COMPLEMENT |
BINARY, COMPLEMENTARY 2'S COMPLEMENT |
Output format |
PARALLEL, 8 BITS |
PARALLEL, 8 BITS |
PARALLEL, 8 BITS |
Package body material |
CERAMIC, GLASS-SEALED |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIP |
QCCJ |
DIP |
Encapsulate equivalent code |
DIP28,.6 |
LDCC28,.5SQ |
DIP28,.6 |
Package shape |
RECTANGULAR |
SQUARE |
RECTANGULAR |
Package form |
IN-LINE |
CHIP CARRIER |
IN-LINE |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
5 V |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Sampling rate |
20 MHz |
20 MHz |
20 MHz |
Maximum seat height |
5.715 mm |
4.57 mm |
5.334 mm |
Maximum slew rate |
160 mA |
160 mA |
160 mA |
Nominal supply voltage |
5 V |
5 V |
5 V |
surface mount |
NO |
YES |
NO |
technology |
BIPOLAR |
BIPOLAR |
BIPOLAR |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
J BEND |
THROUGH-HOLE |
Terminal pitch |
2.54 mm |
1.27 mm |
2.54 mm |
Terminal location |
DUAL |
QUAD |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
15.24 mm |
11.43 mm |
15.24 mm |
Base Number Matches |
1 |
1 |
1 |