128KX8 OTPROM, 200ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Parameter Name | Attribute value |
Maker | Renesas Electronics Corporation |
Parts packaging code | DIP |
package instruction | DIP, |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 200 ns |
JESD-30 code | R-PDIP-T32 |
length | 41.9 mm |
memory density | 1048576 bit |
Memory IC Type | OTP ROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Certification status | Not Qualified |
Maximum seat height | 5.08 mm |
Maximum supply voltage (Vsup) | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
width | 15.24 mm |
Base Number Matches | 1 |
HN27C301P-20 | HN27C301FP-20 | HN27C301FP-25 | HN27C301P-25 | |
---|---|---|---|---|
Description | 128KX8 OTPROM, 200ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | 128KX8 OTPROM, 200ns, PDSO32, PLASTIC, SOP-32 | 128KX8 OTPROM, 250ns, PDSO32, PLASTIC, SOP-32 | 128KX8 OTPROM, 250ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 |
Maker | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation | Renesas Electronics Corporation |
Parts packaging code | DIP | SOIC | SOIC | DIP |
package instruction | DIP, | SOP, | SOP, | DIP, |
Contacts | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Maximum access time | 200 ns | 200 ns | 250 ns | 250 ns |
JESD-30 code | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 |
length | 41.9 mm | 20.45 mm | 20.45 mm | 41.9 mm |
memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
memory width | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 32 | 32 | 32 | 32 |
word count | 131072 words | 131072 words | 131072 words | 131072 words |
character code | 128000 | 128000 | 128000 | 128000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOP | SOP | DIP |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 5.08 mm | 3.05 mm | 3.05 mm | 5.08 mm |
Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | YES | NO |
technology | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL |