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HN27C301P-20

Description
128KX8 OTPROM, 200ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Categorystorage    storage   
File Size196KB,8 Pages
ManufacturerRenesas Electronics Corporation
Websitehttps://www.renesas.com/
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HN27C301P-20 Overview

128KX8 OTPROM, 200ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32

HN27C301P-20 Parametric

Parameter NameAttribute value
MakerRenesas Electronics Corporation
Parts packaging codeDIP
package instructionDIP,
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time200 ns
JESD-30 codeR-PDIP-T32
length41.9 mm
memory density1048576 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals32
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128KX8
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.25 V
Minimum supply voltage (Vsup)4.75 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
Base Number Matches1

HN27C301P-20 Related Products

HN27C301P-20 HN27C301FP-20 HN27C301FP-25 HN27C301P-25
Description 128KX8 OTPROM, 200ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 128KX8 OTPROM, 200ns, PDSO32, PLASTIC, SOP-32 128KX8 OTPROM, 250ns, PDSO32, PLASTIC, SOP-32 128KX8 OTPROM, 250ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Maker Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Parts packaging code DIP SOIC SOIC DIP
package instruction DIP, SOP, SOP, DIP,
Contacts 32 32 32 32
Reach Compliance Code unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum access time 200 ns 200 ns 250 ns 250 ns
JESD-30 code R-PDIP-T32 R-PDSO-G32 R-PDSO-G32 R-PDIP-T32
length 41.9 mm 20.45 mm 20.45 mm 41.9 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 32 32 32 32
word count 131072 words 131072 words 131072 words 131072 words
character code 128000 128000 128000 128000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 128KX8 128KX8 128KX8 128KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP SOP SOP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 5.08 mm 3.05 mm 3.05 mm 5.08 mm
Maximum supply voltage (Vsup) 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V
surface mount NO YES YES NO
technology CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL

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