FIFO, 2KX9, 9ns, Synchronous, CMOS, PDIP28,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Quality Semiconductor Inc |
Reach Compliance Code | unknown |
Maximum access time | 9 ns |
Maximum clock frequency (fCLK) | 66 MHz |
period time | 15 ns |
JESD-30 code | R-PDIP-T28 |
JESD-609 code | e0 |
memory density | 18432 bit |
Memory IC Type | OTHER FIFO |
memory width | 9 |
Number of functions | 1 |
Number of terminals | 28 |
word count | 2048 words |
character code | 2000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2KX9 |
Output characteristics | TOTEM POLE |
Exportable | NO |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP28,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.015 A |
Maximum slew rate | 0.12 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Base Number Matches | 1 |