IC,FLIP-FLOP,OCTAL,D TYPE,S-TTL,DIP,20PIN,PLASTIC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | DIP, DIP20,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-PDIP-T20 |
JESD-609 code | e0 |
Logic integrated circuit type | D FLIP-FLOP |
Maximum Frequency@Nom-Sup | 75000000 Hz |
MaximumI(ol) | 0.02 A |
Number of functions | 8 |
Number of terminals | 20 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Maximum supply current (ICC) | 160 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | TTL |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Trigger type | POSITIVE EDGE |
Base Number Matches | 1 |
DM74S374N/A+ | DM74S374J/A+ | DM74S373J/A+ | DM54S373J | DM54S374J | DM74S373N/A+ | |
---|---|---|---|---|---|---|
Description | IC,FLIP-FLOP,OCTAL,D TYPE,S-TTL,DIP,20PIN,PLASTIC | IC,FLIP-FLOP,OCTAL,D TYPE,S-TTL,DIP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,S-TTL,DIP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,S-TTL,DIP,20PIN,CERAMIC | IC,FLIP-FLOP,OCTAL,D TYPE,S-TTL,DIP,20PIN,CERAMIC | IC,LATCH,SINGLE,8-BIT,S-TTL,DIP,20PIN,PLASTIC |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
package instruction | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
JESD-30 code | R-PDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-PDIP-T20 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D LATCH | D LATCH | D FLIP-FLOP | D LATCH |
Number of functions | 8 | 8 | 1 | 1 | 8 | 1 |
Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO |
technology | TTL | TTL | TTL | TTL | TTL | TTL |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
MaximumI(ol) | 0.02 A | - | - | 0.02 A | 0.02 A | 0.02 A |
Maximum supply current (ICC) | 160 mA | - | - | 190 mA | 160 mA | 190 mA |
Maker | - | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments |