Standard SRAM, 256KX72, 2.25ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | BGA |
package instruction | LBGA, |
Contacts | 209 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.B |
Maximum access time | 2.25 ns |
Other features | PIPELINED ARCHITECTURE |
JESD-30 code | R-PBGA-B209 |
JESD-609 code | e1 |
length | 22 mm |
memory density | 18874368 bit |
Memory IC Type | STANDARD SRAM |
memory width | 72 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 209 |
word count | 262144 words |
character code | 256000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 256KX72 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 1.7 mm |
Maximum supply voltage (Vsup) | 1.95 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 14 mm |
Base Number Matches | 1 |