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GS8170LW72GC-200I

Description
Standard SRAM, 256KX72, 2.25ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209
Categorystorage    storage   
File Size884KB,27 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance  
Download Datasheet Parametric View All

GS8170LW72GC-200I Overview

Standard SRAM, 256KX72, 2.25ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209

GS8170LW72GC-200I Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Parts packaging codeBGA
package instructionLBGA,
Contacts209
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time2.25 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PBGA-B209
JESD-609 codee1
length22 mm
memory density18874368 bit
Memory IC TypeSTANDARD SRAM
memory width72
Humidity sensitivity level3
Number of functions1
Number of terminals209
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX72
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.7 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
Base Number Matches1

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