Synchronous DRAM, 4MX16, 8ns, CMOS, PDSO54,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
package instruction | SON, SOLCC54,.3,20 |
Reach Compliance Code | compliant |
Is Samacsys | N |
Maximum access time | 8 ns |
Maximum clock frequency (fCLK) | 100 MHz |
I/O type | COMMON |
interleaved burst length | 1,2,4,8 |
JESD-30 code | R-PDSO-N54 |
JESD-609 code | e0 |
memory density | 67108864 bit |
Memory IC Type | SYNCHRONOUS DRAM |
memory width | 16 |
Number of terminals | 54 |
word count | 4194304 words |
character code | 4000000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 4MX16 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SON |
Encapsulate equivalent code | SOLCC54,.3,20 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 4096 |
Continuous burst length | 1,2,4,8,FP |
Maximum standby current | 0.0004 A |
Maximum slew rate | 0.13 mA |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD |
Terminal pitch | 0.5 mm |
Terminal location | DUAL |
Base Number Matches | 1 |
GM72V661641DLI-10K | GM72V661641DI-8 | GM72V661641DI-10K | |
---|---|---|---|
Description | Synchronous DRAM, 4MX16, 8ns, CMOS, PDSO54, | Synchronous DRAM, 4MX16, 6ns, CMOS, PDSO54, | Synchronous DRAM, 4MX16, 8ns, CMOS, PDSO54, |
Is it Rohs certified? | incompatible | incompatible | incompatible |
package instruction | SON, SOLCC54,.3,20 | SON, SOLCC54,.3,20 | SON, SOLCC54,.3,20 |
Reach Compliance Code | compliant | compliant | compliant |
Maximum access time | 8 ns | 6 ns | 8 ns |
Maximum clock frequency (fCLK) | 100 MHz | 125 MHz | 100 MHz |
I/O type | COMMON | COMMON | COMMON |
interleaved burst length | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 |
JESD-30 code | R-PDSO-N54 | R-PDSO-N54 | R-PDSO-N54 |
JESD-609 code | e0 | e0 | e0 |
memory density | 67108864 bit | 67108864 bit | 67108864 bit |
Memory IC Type | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
memory width | 16 | 16 | 16 |
Number of terminals | 54 | 54 | 54 |
word count | 4194304 words | 4194304 words | 4194304 words |
character code | 4000000 | 4000000 | 4000000 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C |
organize | 4MX16 | 4MX16 | 4MX16 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SON | SON | SON |
Encapsulate equivalent code | SOLCC54,.3,20 | SOLCC54,.3,20 | SOLCC54,.3,20 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
power supply | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 4096 | 4096 | 4096 |
Continuous burst length | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP |
Maximum standby current | 0.0004 A | 0.002 A | 0.002 A |
Maximum slew rate | 0.13 mA | 0.165 mA | 0.13 mA |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
surface mount | YES | YES | YES |
technology | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | NO LEAD | NO LEAD | NO LEAD |
Terminal pitch | 0.5 mm | 0.5 mm | 0.5 mm |
Terminal location | DUAL | DUAL | DUAL |
Maker | - | SK Hynix | SK Hynix |