Form No:
XXXXX-7-0000-TBM03-170300527
Specification for Approval
Date:
2017/03/23
Customer :
深圳臺慶
TAI-TECH P/N:
CUSTOMER P/N:
DESCRIPTION:
QUANTITY:
TMPA0605SV-Series(N)-D
pcs
REMARK:
Customer Approval Feedback
□ 西北臺慶科技股½有限公司
TAI-TECH Advanced Electronics Co., Ltd
Headquarter:
NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI,
TAO-YUAN HSIEN, TAIWAN, R.O.C.
TEL: +886-3-4641148 FAX: +886-3-4643565
http://www.tai-tech.com.tw
E-mail: sales@tai-tech.com.tw
Sales Dep.
□
Office:
深圳辦公室
11BC,Building B Fortune Plaza,NO.7002, Shennan Avenue, Futian
District Shenzhen
TEL: +86- 755-23972371
FAX: +86-755-23972340
APPROVED
CHECKED
□
臺慶精密電子(昆山)有限公司
TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD
SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN,
JIANG-SU, CHINA
TEL: +86-512-57619396 FAX: +86-512-57619688
E-mail: sales@tai-tech.cn
管哲頎
Eric Kuan
曾詩涵
Angela Tseng
Office:
北欣國際有限公司
NORTH STAR INTERNATIONAL LIMITED
TEL: +86-512-57619396
FAX: +86-512-57619688
R&D Center
APPROVED
CHECKED
DRAWN
■ 慶邦電子元器件(泗洪)有限公司
TAIPAQ ELECTRONICS (SIHONG) CO., LTD
Sihong development zone Suqian City, Jiangsu , CHINA.
TEL: +86-527-88601191 FAX: +86-527-88601190
E-mail: sales@taipaq.cn
楊祥忠
Mike Yang
詹偉特
Jack Chan
½秦芝
Sharon Ho
TAI-TECH
P1
SMD Power Inductor
TMPA0605SV-Series(N)-D
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
17/03/23
新發行
楊祥忠
詹偉特
½秦芝
備
注
TAI-TECH
P2
SMD Power Inductor
1. Features
1. Shielded construction.
2. Capable of corresponding high frequency (5MHz).
3. Low loss realized with low DCR.
4. High performance (Isat) realized by metal dust core.
5. Ultra low buzz noise, due to composite construction.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. High reliability -Reliability test complied to AEC-Q200
TMPA0605SV-Series(N)-D
Halogen
Halogen-free
Pb
Pb-free
2. Applications
1. DC/DC converters in distributed power systems.
2. DC/DC converter for Field Programmable Gate Array(FPGA).
3. Battery powered devices.
4. Thin type on-board power supply module for exchanger.
5. VRM for server.
6. High current, low profile POL converters.
7. PDA/notebook/desktop/server and battery powered devices.
3. Dimensions
A
A`
C
Recommend PC Board Pattern
D
L
1R0
1526
B
E
G
Series
TMPA0605
Unit:mm
A
A`
B
C
D
E
3.0±0.2
L(mm)
G(mm)
H
H(mm)
7.3±0.3 6.7±0.2 6.6±0.3 4.8±0.2 1.6±0.3
4. Part Numbering
TMPA
A
8.0
3.5
3.4
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.15mm and above.
0605
B
SV
C
-
1R0
D
MN
E
-
D
F
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: Code
BxC
Standard.
R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh.
K=±10%，L=±15%，M=±20%，N=±25%，Y=±30%
Marking: Black.1R0 and 1526(15 YY, 26 WW,follow production date).
TAI-TECH
P3
5. Specification
Part Number
Inductance
L0 A(uH)
±20%
0.47
0.68
1.00
1.50
2.20
3.30
4.70
6.80
8.20
10.0
15.0
22.0
47.0
Heat Rating
Current DC
( A ) Irms.
Typ
22
20
17
15
14
13
11
9.0
7.5
7.0
5.0
4.2
2.6
Saturation
Current DC
(A)I sat
Typ
22
20
16
13
10
9.5
8.8
7.6
6.5
6.0
4.0
3.6
1.8
DCR
(mΩ)Typ
2.9
3.6
5.6
6.6
10
14
20.8
30
38.5
44
73
122
275
DCR
(mΩ)Max
3.3
4.1
6.2
7.3
11.5
16.2
24
36
45
53
85
142
320
Max
20
18
15
13
12
11
9.5
8.0
6.5
6.0
4.0
3.6
2.0
Max
20
17
13
10.5
8.5
8.0
7.5
7.0
6.0
5.7
3.2
3.1
1.5
TMPA0605SV-R47MN-D
TMPA0605SV-R68MN-D
TMPA0605SV-1R0MN-D
TMPA0605SV-1R5MN-D
TMPA0605SV-2R2MN-D
TMPA0605SV-3R3MN-D
TMPA0605SV-4R7MN-D
TMPA0605SV-6R8MN-D
TMPA0605SV-8R2MN-D
TMPA0605SV-100MN-D
TMPA0605SV-150MN-D
TMPA0605SV-220MN-D
TMPA0605SV-470MN-D
Note:
1. Test frequency :
Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately
ΔT
of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately
30%.
6. The part temperature (ambient + temp rise) should not exceed 155
℃
under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
P4
6. Material List
NO
1
2
3
4
Items
Core
Wire
Clip
Ink
Alloy Powder .
Polyester Wire or equivalent.
100% Pb free solder(Ni+Sn---Plating)
Halogen-free ketone
Materials
7. Reliability and Test Condition
Item
Operating temperature
Storage temperature and
Humidity range
Performance
-55~+155℃(Including self - temperature rise)
1. -10~+40℃,50~60%RH (Product without taping)
2. -55~+155℃(on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
Saturation Current (Isat)
Approximately
△L30%
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
to drop
△L(%)
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃)
1.Applied the allowed DC current
2.Temperature measured by digital surface thermometer
Heat Rated Current (Irms)
Approximately
△T40℃
Reliability Test
High Temperature
Exposure(Storage)
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Temperature：155±2℃(Inductor)
Duration
：1000hrs
Min.
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Condition for 1 cycle
Step1：-55±2℃ 30min Min.(Inductor)
Step2：155±2℃ transition time 1min MAX.
Step3：155±2℃ 30min Min.
Step4：Low temp. transition time 1min MAX.
Number of cycles： 1000
Measured at room temperature after placing for 24±2 hrs
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature after placing
for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3
hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3
hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of
10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification
Reflow Profiles
Humidity
：85±3﹪R.H,
Temperature：85℃±2℃
Duration : 1000hrs Min with 100% rated current.
Measured at room temperature after placing for24±2 hrs
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Temperature：155±2℃(Inductor)
Duration
：1000hrs
Min. with 100% rated current.
Measured at room temperature after placing for24±2 hrs
Oscillation Frequency: 10½2K½10Hz for 20 minute
Equipment： Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Temperature Cycling
Moisture Resistance
Appearance：No damage.
Inductance：within±10% of initial value
Q：Shall not exceed the specification value.
RDC：within ±15% of initial value and shall not
exceed the specification value
Biased Humidity
(AEC-Q200)
High Temperature
Operational Life
(AEC-Q200)
Vibration
Sensor
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