The Group manufactures and sells discrete power semiconductors and enters the markets of China, Taiwan and other Asian regions under its "PFC" brand. The Group's research and development team is located in Taiwan and focuses on improving product performance and developing new products and technologies. The Group's discrete power semiconductors use proprietary patented component structures and manufacturing methods developed by the Group's internal research and development team. As of the Latest Practicable Date, the Group holds 46 patents registered in the United States, Taiwan and China for the component structures and/or manufacturing methods of its discrete power semiconductors. The Group manufactures most of its products at its Shunde Production Plant located in Shunde, Guangdong, the PRC. In the discrete power semiconductor manufacturing process, the Group performs the packaging and testing processes in the manufacturing process at the Shunde Production Plant and outsources the wafer processing process to an outsourced wafer processing factory. The Group also outsources the packaging process of certain package types of discrete power semiconductors to an outsourced packaging company. As of the Latest Practicable Date, the Group had a total of 94 employees at the Shunde Production Plant. The Group operates sales offices in Taiwan and Hong Kong, the PRC, and a sales logistics office in Shenzhen, the PRC. The Taiwan Sales Office oversees the Group's sales and marketing operations. Most of the Group's discrete power semiconductors are sold to distributors, who in turn resell to direct users of the Group's products, namely, mainly power supply manufacturers, which are then used in a variety of electronic devices.
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https://cn.silabs.com/development-tools/mcu/32-bit/efm32pg22-development-kit Then select "Get Started"on the web pageand download and installSimplicity Studio vers...
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[align=left] [color=#3d3d3d][font="][size=10.5pt]Click here to download the handouts for this seminar: [/size][/font][/color][/align][align=left][b]https://ez.analog.com/cn/webcasts/f/forum/109744/thr...
This article introduces how to implement FM radio function in embedded systems, focusing on the working principle, hardware and software design and key points of FM chip TEA5760, and gives the test re...
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Concept diagram of the latest electromagnetic wave absorption and shielding materials. Image source: Korea Institute of Materials Science
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At the Ministry of Commerce's regular press conference, a spokesperson responded to the U.S. Department of Commerce's letter to TSMC imposing export restrictions on certain complex chips of 7 nanom...[Details]