Macronix is a global leader in non-volatile memory integrated components, providing ROM read-only memory, NOR flash memory and NAND flash memory solutions across a wide range of specifications and capacities. With world-class R&D and manufacturing capabilities, Macronix provides the highest quality, innovative and high-performance products for customers to apply in consumer, communications, computers, automotive electronics, network communications and other fields.
• Multi I/O Support - Single I/O, Dual I/O and Quad I/O
• Hold Feature
• Program Suspend/Resume & Erase Suspend/Resume
P/N: PM2305
1
Rev. 1.2, October 18, 2016
MX25L6436F
Contents
1. FEATURES ........................................................................................................................................................ 4
2. GENERAL DESCRIPTION ............................................................................................................................... 5
6. DATA PROTECTION.......................................................................................................................................... 8
Table 1. Protected Area Sizes ................................................................................................................9
9. HOLD FEATURE.............................................................................................................................................. 13
11. POWER-ON STATE ....................................................................................................................................... 73
15. ERASE AND PROGRAMMING PERFORMANCE ........................................................................................ 84
16. DATA RETENTION ........................................................................................................................................ 84
18. ORDERING INFORMATION .......................................................................................................................... 85
19. PART NAME DESCRIPTION ......................................................................................................................... 86
20. PACKAGE INFORMATION ............................................................................................................................ 87
21. REVISION HISTORY ..................................................................................................................................... 88
P/N: PM2305
3
Rev. 1.2, October 18, 2016
MX25L6436F
64M-BIT [x 1 / x 2 / x 4] CMOS MXSMIO
®
(SERIAL MULTI I/O)
FLASH MEMORY
1. FEATURES
GENERAL
• Supports Serial Peripheral Interface -- Mode 0
and Mode 3
•
67,108,864 x 1 bit structure
or 33,554,432 x 2 bits (two I/O read mode)
structure
or 16,777,216 x 4 bits (four I/O mode) structure
• 2048 Equal Sectors with 4K bytes each
- Any Sector can be erased individually
• 256 Equal Blocks with 32K bytes each
- Any Block can be erased individually
• 128 Equal Blocks with 64K bytes each
- Any Block can be erased individually
• Power Supply Operation
- 2.65 to 3.6 volt for read, erase, and program
operations
• Latch-up protected to 100mA from -1V to Vcc
+1V
PERFORMANCE
• High Performance
VCC = 2.65~3.6V
- Normal read
- 50MHz
- Fast read
- FAST_READ, DREAD, QREAD: 133MHz
with 8 dummy cycles
- 2READ: 80MHz with 4 dummy cycle,
133MHz with 8 dummy cycle
- 4READ: 80MHz with 6 dummy cycle,
133MHz with 10 dummy cycle
- Configurable dummy cycle number for
2READ and 4READ operation
- 8/16/32/64 byte Wrap-Around Burst Read
Mode
• Low Power Consumption
• Typical 100,000 erase/program cycles
• 20 years data retention
SOFTWARE FEATURES
•
Input Data Format
-
1-byte Command code
•
Advanced Security Features
- Special Block lock protection
The BP0-BP3 and T/B status bits define the size of
the area to be protected against program and erase
instructions
•
Additional 8K-bit bit security OTP
-
Features unique identifier
-
Factory locked identifiable, and customer lockable
•
Auto Erase and Auto Program Algorithms
-
Automatically erases and verifies data at selected
sector
-
Automatically programs and verifies data at selected
page by an internal algorithm that automatically
times the program pulse width (Any page to be pro-
grammed should have page in the erased state first.)
•
Status Register Feature
•
Command Reset
•
Program/Erase Suspend
•
Program/Erase Resume
•
Electronic Identification
-
JEDEC 1-byte Manufacturer ID and 2-byte Device ID
- RES command for 1-byte Device ID
•
Support Serial Flash Discoverable Parameters (SFDP)
mode
HARDWARE FEATURES
•
SCLK Input
• SI/SIO0
-
Serial Data Input or Serial Data Input/Output for 2 x I/
O mode or Serial Data Input/Output for 4 x I/O mode
• SO/SIO1
-
Serial Data Output or Serial Data Input/Output for 2 x
I/O mode or Serial Data Input/Output for 4 x I/O mode
• WP#/SIO2
-
Hardware write protection or serial data Input/Output
for 4 x I/O mode
• HOLD#/SIO3
-
To pause the device without deselecting the device or
serial data Input/Output for 4 x I/O mode
• PACKAGE
-
8-pin SOP (200mil)
-
All devices are RoHS Compliant and Halogen-free
-
Serial clock input
P/N: PM2305
4
Rev. 1.2, October 18, 2016
MX25L6436F
2. GENERAL DESCRIPTION
MX25L6436F is 64Mb bits Serial NOR Flash memory, which is configured as 8,388,608 x 8 internally. When it is
in four I/O mode, the structure becomes 16,777,216 bits x 4. When it is in two I/O mode, the structure becomes
33,554,432 bits x 2.
MX25L6436F features a serial peripheral interface and software protocol allowing operation on a simple 3-wire
bus while it is in single I/O mode. The three bus signals are a clock input (SCLK), a serial data input (SI), and a
serial data output (SO).
Serial
access to the device is enabled by CS# input.
MX25L6436F, MXSMIO
®
(Serial Multi I/O) flash memory, provides sequential read operation on the whole chip
and multi-I/O features.
When it is in quad I/O mode, the SI pin, SO pin, WP# pin and HOLD# pin become SIO0 pin, SIO1 pin, SIO2 pin
and SIO3 pin for address/dummy bits input and data Input/Output.
After program/erase command is issued, auto program/erase algorithms which program/erase and verify the
specified page or sector/block locations will be executed. Program command is executed on byte basis, or page (256
bytes) basis. Erase command is executed on 4K-byte sector, 32K-byte/64K-byte block, or whole chip basis.
To provide user with ease of interface, a status register is included to indicate the status of the chip. The status
read command can be issued to detect completion status of a program or erase operation via WIP bit.
When the device is not in operation and CS# is high, it is put in standby mode.
The MX25L6436F utilizes Macronix's proprietary memory cell, which reliably stores memory contents even after
Playing is a child's nature and a child's right. For children, playing is learning. During the process, the child gets great psychological satisfaction and pleasure, and his physical functions are als...
This article and design code were written by FPGA enthusiast Xiao Meige. Without the author's permission, this article is only allowed to be copied and reproduced on online forums, and the original au...
LED hard light strip 24V, built-in 2813IC 60 lights per meter, I want to ask if anyone who knows can tell me what the black 5-pin component is? Is it a voltage regulator? What role does it play in thi...
tests/multi_bluetooth: Add multitests for BLE pairing and bonding.
extmod/nimble: Generate and persist a unique IRK.
docs/library/ubluetooth.rst: Add passkey docs.
examples/bluetooth: Add bonding/pass...
For portable devices, power management is a very important and key component. Power management ICs are usually divided into integrated and discrete types, and the integrated type is also called power ...
Due to the development of technology, the trend of high-speed circuit design requires:SI , PI and EMI collaborative design;
Chip, package and system co-design;
Multiphysics collaborative design.This c...
The U.S. CHIPS Act (official name: CHIPS and Science Act) has begun building new semiconductor factories in the country. Currently, at least nine new plants are planned or under construction, and man...[Details]
The semiconductor industry is not only facing a chip shortage problem, but also a shortage of labor and skills. The shortage of semiconductor talent is not only happening in China, but also around th...[Details]
On the evening of September 3, SMIC issued an announcement of major personnel changes. Chairman and Executive Director Dr. Zhou Zixue resigned from the positions of Chairman of the Company and Chairm...[Details]
Since Apple gave up using Intel chips to manufacture Macs and switched to M-series self-developed chips, Apple has started a "one chip a year" rhythm. The whole world is paying attention to Apple's ...[Details]
Recently, Yole Développement released the Advanced Packaging Technology Report for the first quarter of 2022. Gabriela Pereira, Semiconductor, Memory & Computing Technology & Market Analyst and Packa...[Details]
Hua Hong Semiconductor announced that the company’s application for the initial public offering of RMB ordinary shares (A shares) and listing on the Science and Technology Innovation Board has been r...[Details]
The National Bureau of Statistics released the 2022 National Economic and Social Development Statistical Bulletin (hereinafter referred to as the "Statistical Bulletin") on February 28. According t...[Details]
Thief River Falls, Minnesota, USA - DigiKey, a leading global commercial distributor of broad, fast-shipping, off-the-shelf technology components and automation products, today announced a signific...[Details]
The 29th China Integrated Circuit Design Industry 2023 Annual Conference and Guangzhou Integrated Circuit Industry Innovation and Development Summit Forum (ICCAD) will be grandly opened in Guangzhou...[Details]
The launching ceremony of the Chinese Academy of Sciences Integrated Circuit Innovation (Macau) Institute was held in Macau. It will jointly establish Macau Douqi Integrated Circuit Manufacturing Co....[Details]
TSMC President Wei Zhejia recorded an 11-minute video to encourage employees to take vacations to recharge, triggering market concerns that unpaid leave may be inappropriate. TSMC issued a statement ...[Details]
On April 8, according to South Korean electronics industry media TheElec, Samsung Electronics successfully won Nvidia's 2.5D packaging order. Sources revealed that Samsung's advanced packaging (AVP...[Details]
Due to various factors, the mature process of wafer foundry has unexpectedly become popular. Recently, Chinese companies have made a sharp turn and are discussing using more mature process chips to r...[Details]
5G connects the world intelligently, building the future with "cores"! The 18th China Communications Integrated Circuit Technology Application Seminar and 2020 Wuxi Integrated Circuit Innovation Summ...[Details]
In the latest issue of Science, a team from the Pritzker School of Molecular Engineering at the University of Chicago demonstrated a new breakthrough in the field of interfacial bioelectronics: the...[Details]