SPECIFICATION FOR APPROVAL
Customer
：
Customer P/N:
Drawing No
：
Quantity
：
Chilisin P/N
：
X
Pcs.
TE1-820061
Date :
2018/02/06
超利維
MHCH252010A-R24M-AU
Automotive Grade Inductor
Holegen Free
RoHS Compliant
REACH Compliant
Lead Free Solders
AEC-Q200
奇力新電子股½有限公司
Chilisin Electronic sCorp
No. 29, Alley 301, Tehhsin Rd.,
Hukou,Hsinchu 303, Taiwan
TEL：+886-3- 599-2646
FAX：+886-3- 599-9176
E-mail：sales@chilisin.com.tw
http：//www.chilisin.com.tw
東莞奇力新電子有限公司
Chilisin Electronics (Dongguan) Co., Ltd.
No. 78, Puxing Rd., Yuliangwei Administration Area,
Qingxi Town, Dongguan City, Guangdong,China
TEL：+86-769-8773-0251~3
FAX： +86-769-8773-0232
E-mail：cect@chilisin.com.tw
奇力新電子(河南)有限公司
Chilisin Elec
tronics (Henan) Co., Ltd.
XiuWu Xian, industry gathering area
JiaoZuo, Henan China
Postal Code:454350
TEL:+86-391-717-0682
FAX:+86-391-717-0666
奇力新電子(蘇州)有限公司
Chilisin Electronics (Suzhou) Co., Ltd.
No.143,Song Shan Rd., Suzhou New District,
Suzhou,China
Postal Code:215129
TEL:+86-512-6841-2350
FAX:+86-512-6841-2356
E-mail：suzhou@chilisin.com.tw
Drawn by
張鈺雯
Chang.Yuwen
Checked by
張鈺雯
Chang.Yuwen
Approved by
鍾瑞民
Jacky.Chung
MHCH252010A Series Specification
9
Reliability of molding power inductors
1-1.Mechanical Performance
No
Item
1-1-1 Board Flex
AEC-Q200
Specification
The forces applied on the right
Test Method
1-1-2 Terminal Strength Test
Refer to AEC-Q200-005
conditions must not damage Test device shall be soldered on the substrate
the terminal electrode and the Substrate Dimension: 100x40x1.6mm
metal body
Deflection: 2.0mm
Keeping Time: 60sec
Appearance: No damage
Refer AEC-Q200-006
Soldered on PCB for testing as fig.
Chip
Force : 1.8kg
Keeping Time: 60 seconds.
Mounting Pad
F
1-1-3 Solder ability
The electrodes shall be at
least 95% covered with new
solder coating
1-1-4 Resistance to Soldering Heat Appearance: No damage
Inductance: within ±20% of
initial value
Refer to J-STD-002
Pre-heating: 150
℃
, 1min
Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)
Solder Temperature: 245±5
℃
(Pb-Free)
Immersion Time: 4±1sec
Refer to MIL-STD-202 Method 210
Pre-heating: 150
℃
, 1min
Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)
Solder Temperature: 260±5
℃
Immersion Time: 10±1sec
Inductors must withstand 6 minutes of alcohol or water.
1-1-5 Resistance to Solvents
There must be no change in
appearance or obliteration of
marking.
1-1-6 Mechanical Shock
The forces applied on the right Pulse shape
：
Half-sine waveform
conditions must not damage Impact acceleration
：
100 g
the terminal electrode and the Pulse duration
：
6 ms
ferrite.
Number of shocks
：
18 shocks (3 shocks for each face)
Orientation
：
Bottom, top, left, right, front and rear faces
Appearance: No damage
Inductance change shall be
within ±20%.
Refer MIL-STD-202 Method 204
Vibration waveform: Sine waveform
Vibration frequency: 10Hz~2000Hz
Vibration acceleration: 5g
Sweep rate: 0.764386otcave/minute
Duration of test: 12 cycles each of 3 orientations,
20 minutes for each cycle
Vibration axes: X, Y & Z
1-1-7 Vibration
1-2.Environmental Performance
No
Item
1-2-1 Temperature Cycle
Specification
Test Method
Refer to JESD Method JA-104
Total cycles: 1000 cycles
Temperature Cycling Test Conditions : -40 to +125
℃
Soak Mode Condition : 30 minutes
Measured after exposure in the room condition for 24hrs
Temperature: 125±2
℃
Appliend Current : Rated Current
Time: 1000± 24 hrs
Measured after exposure in the room condition for 24hrs
Refer to MIL-STD-202 Method 103
Appearance: No damage
Inductance:within±30% of
initial value
1-2-2 Operational Life
1-2-2 Biased Humidity Resistance
Test/Measurement
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