Clock Generator, PDSO56
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | IDT (Integrated Device Technology) |
| package instruction | 6.10 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-153, TSSOP-56 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Is Samacsys | N |
| JESD-30 code | R-PDSO-G56 |
| JESD-609 code | e3 |
| Humidity sensitivity level | 1 |
| Number of terminals | 56 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP56,.3,20 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum slew rate | 350 mA |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) - annealed |
| Terminal form | GULL WING |
| Terminal pitch | 0.5 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
| ICS932S421CGLFT | ICS932S421CGLF | ICS932S421CFLFT | ICS932S421CFLF | |
|---|---|---|---|---|
| Description | Clock Generator, PDSO56 | Processor Specific Clock Generator, 400MHz, CMOS, PDSO56, 0.240 INCH, 0.020 INCH PITCH, LEAD FREE, MO-153, TSSOP-56 | Clock Generator, PDSO56 | Processor Specific Clock Generator, 400MHz, CMOS, PDSO56, LEAD FREE, MO-118, SSOP-56 |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 code | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 | R-PDSO-G56 |
| JESD-609 code | e3 | e3 | e3 | e3 |
| Humidity sensitivity level | 1 | 1 | 1 | 1 |
| Number of terminals | 56 | 56 | 56 | 56 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | TSSOP | SSOP | SSOP |
| Encapsulate equivalent code | TSSOP56,.3,20 | TSSOP56,.3,20 | SSOP56,.4 | SSOP56,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 |
| power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 350 mA | 350 mA | 350 mA | 350 mA |
| Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.5 mm | 0.5 mm | 0.635 mm | 0.635 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 |
| Base Number Matches | 1 | 1 | 1 | 1 |
| Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - |
| package instruction | 6.10 MM, 0.50 MM PITCH, ROHS COMPLIANT, MO-153, TSSOP-56 | TSSOP, TSSOP56,.3,20 | - | LEAD FREE, MO-118, SSOP-56 |
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