S72WS512NEGBAW4Y3 datasheet, PDF

S72WS512NEGBAW4Y3: DescriptionBased MCP/PoP Products; Categorystorage storage; File Size799KB，30 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/

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S72WS512NEGBAW4Y3 Overview

Based MCP/PoP Products

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	LFBGA,
Contacts	137
Reach Compliance Code	compli
Other features	MOBILE SDRAM IS ORGANIZED AS 4M X 16BIT X 4 BANKS; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 code	R-PBGA-B137
JESD-609 code	e0
length	13 mm
memory density	536870912 bi
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	137
word count	33554432 words
character code	32000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	32MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	11 mm
Base Number Matches	1

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