HIGH GRADE Specification HIGH RELIABILITY series SPI BUS Serial EEPROMs Supply voltage 2.5V~5.5V Operating temperature -40∑C ~ +125∑C type
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Parts packaging code | SOIC |
package instruction | LEAD FREE, SOP-8 |
Contacts | 8 |
Reach Compliance Code | compli |
ECCN code | EAR99 |
Maximum clock frequency (fCLK) | 5 MHz |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e2 |
length | 5 mm |
memory density | 2048 bi |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 256 words |
character code | 256 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -40 °C |
organize | 256X8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LSOP |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, LOW PROFILE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | Not Qualified |
Maximum seat height | 1.6 mm |
Serial bus type | SPI |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 2.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | AUTOMOTIVE |
Terminal surface | TIN COPPER |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 10 |
width | 4.4 mm |
Maximum write cycle time (tWC) | 5 ms |
Base Number Matches | 1 |