|
BR93H76RFJ-2CE2 |
BR93H76RF-2CE2 |
BR93H76RFVT-2CE2 |
Description |
EEPROM (3-Wire) 2MHz 8Kbit 2.5-5.5V |
EEPROM (3-Wire) 2MHz 8Kbit 2.5-5.5V |
EEPROM (3-Wire) 2MHz 8Kbit 2.5-5.5V |
Is it Rohs certified? |
conform to |
conform to |
conform to |
package instruction |
SOP-8 |
SOP-8 |
TSSOP-8 |
Reach Compliance Code |
compliant |
compliant |
compliant |
Maximum clock frequency (fCLK) |
2 MHz |
2 MHz |
2 MHz |
Data retention time - minimum |
100 |
100 |
100 |
Durability |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
1000000 Write/Erase Cycles |
JESD-30 code |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
length |
4.9 mm |
5 mm |
4.4 mm |
memory density |
8192 bit |
8192 bit |
8192 bit |
Memory IC Type |
EEPROM |
EEPROM |
EEPROM |
memory width |
16 |
16 |
16 |
Number of functions |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
word count |
512 words |
512 words |
512 words |
character code |
512 |
512 |
512 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
organize |
512X16 |
512X16 |
512X16 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LSOP |
SOP |
TSSOP |
Encapsulate equivalent code |
SOP8,.25 |
SOP8,.25 |
TSSOP8,.25 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, LOW PROFILE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
3/5 V |
3/5 V |
3/5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Filter level |
AEC-Q100 |
AEC-Q100 |
AEC-Q100 |
Maximum seat height |
1.65 mm |
1.71 mm |
1.2 mm |
Serial bus type |
MICROWIRE |
MICROWIRE |
MICROWIRE |
Maximum standby current |
0.00001 A |
0.00001 A |
0.00001 A |
Maximum slew rate |
0.003 mA |
0.003 mA |
0.003 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
Nominal supply voltage (Vsup) |
4 V |
4 V |
4 V |
surface mount |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
1.27 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
3.9 mm |
4.4 mm |
3 mm |
Maximum write cycle time (tWC) |
4 ms |
4 ms |
4 ms |
write protect |
SOFTWARE |
SOFTWARE |
SOFTWARE |
Base Number Matches |
1 |
1 |
1 |
Other features |
SEATED HT-CALCULATED |
SEATED HT-CALCULATED |
- |
Factory Lead Time |
- |
16 weeks |
16 weeks |