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GS816036DGT-375

Description
SRAM 2.5 or 3.3V 512K x 36 18M
Categorystorage    storage   
File Size234KB,24 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance
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GS816036DGT-375 Overview

SRAM 2.5 or 3.3V 512K x 36 18M

GS816036DGT-375 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerGSI Technology
Parts packaging codeQFP
package instructionLQFP,
Contacts100
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Factory Lead Time10 weeks
Maximum access time4.2 ns
Other featuresFLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V
JESD-30 codeR-PQFP-G100
length20 mm
memory density18874368 bit
Memory IC TypeCACHE SRAM
memory width36
Number of functions1
Number of terminals100
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize512KX36
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm

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