MOSFET 200 Amps 100V 5.4 Rds
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IXYS |
Parts packaging code | TO-3P |
package instruction | PLASTIC, TO-3P, 3 PIN |
Contacts | 3 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Other features | AVALANCHE RATED |
Avalanche Energy Efficiency Rating (Eas) | 1500 mJ |
Shell connection | DRAIN |
Configuration | SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage | 100 V |
Maximum drain current (Abs) (ID) | 200 A |
Maximum drain current (ID) | 200 A |
Maximum drain-source on-resistance | 0.0055 Ω |
FET technology | METAL-OXIDE SEMICONDUCTOR |
JESD-30 code | R-PSFM-T3 |
JESD-609 code | e3 |
Number of components | 1 |
Number of terminals | 3 |
Operating mode | ENHANCEMENT MODE |
Maximum operating temperature | 175 °C |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | FLANGE MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | N-CHANNEL |
Maximum power dissipation(Abs) | 550 W |
Maximum pulsed drain current (IDM) | 500 A |
Certification status | Not Qualified |
surface mount | NO |
Terminal surface | Matte Tin (Sn) |
Terminal form | THROUGH-HOLE |
Terminal location | SINGLE |
Maximum time at peak reflow temperature | NOT SPECIFIED |
transistor applications | SWITCHING |
Transistor component materials | SILICON |