9DB106BGLF datasheet, PDF - EEWORLD Datasheet

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9DB106BGLF: DescriptionClock Buffer 6 OUTPUT PCIE GEN2 BUFFER; Categorylogic logic; File Size188KB，14 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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9DB106BGLF Overview

Clock Buffer 6 OUTPUT PCIE GEN2 BUFFER

9DB106BGLF Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	TSSOP
package instruction	TSSOP, TSSOP28,.25
Contacts	28
Manufacturer packaging code	PGG28
Reach Compliance Code	compliant
ECCN code	EAR99
series	9DB
Input adjustment	DIFFERENTIAL
JESD-30 code	R-PDSO-G28
JESD-609 code	e3
length	9.7 mm
Logic integrated circuit type	PLL BASED CLOCK DRIVER
Humidity sensitivity level	1
Number of functions	1
Number of inverted outputs
Number of terminals	28
Actual output times	6
Maximum operating temperature	70 °C
Minimum operating temperature
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP28,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260
power supply	3.3 V
Prop。Delay @ Nom-Sup	0.15 ns
propagation delay (tpd)	0.15 ns
Certification status	Not Qualified
Same Edge Skew-Max（tskwd）	0.045 ns
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
Temperature level	COMMERCIAL
Terminal surface	Matte Tin (Sn) - annealed
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	4.4 mm
Base Number Matches	1

9DB106BGLF Related Products

	9DB106BGLF	9DB106BFLFT	9DB106BGILFT	9DB106BGLFT	9DB106BFLF	9DB106BFILFT
Description	Clock Buffer 6 OUTPUT PCIE GEN2 BUFFER	Clock Buffer 6 OUTPUT PCIE GEN2 BUFFER	Clock Buffer 6 OUTPUT PCIE GEN2 BUFFER	Clock Buffer 6 OUTPUT PCIE GEN2 BUFFER	Clock Buffer 6 OUTPUT PCIE GEN2 BUFFER	Clock Buffer 6 OUTPUT PCIE GEN2 BUFFER
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	TSSOP	SSOP	TSSOP	TSSOP	SSOP	SSOP
package instruction	TSSOP, TSSOP28,.25	SSOP-28	TSSOP, TSSOP28,.25	TSSOP, TSSOP28,.25	SSOP-28	SSOP-28
Contacts	28	28	28	28	28	28
Manufacturer packaging code	PGG28	PYG28	PGG28	PGG28	PYG28	PYG28
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
series	9DB	9DB	9DB	9DB	9DB	9DB
Input adjustment	DIFFERENTIAL	DIFFERENTIAL	DIFFERENTIAL	DIFFERENTIAL	DIFFERENTIAL	DIFFERENTIAL
JESD-30 code	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28	R-PDSO-G28
JESD-609 code	e3	e3	e3	e3	e3	e3
length	9.7 mm	10.2 mm	9.7 mm	9.7 mm	10.2 mm	10.2 mm
Logic integrated circuit type	PLL BASED CLOCK DRIVER	PLL BASED CLOCK DRIVER	PLL BASED CLOCK DRIVER	PLL BASED CLOCK DRIVER	PLL BASED CLOCK DRIVER	PLL BASED CLOCK DRIVER
Humidity sensitivity level	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1
Number of terminals	28	28	28	28	28	28
Actual output times	6	6	6	6	6	6
Maximum operating temperature	70 °C	70 °C	85 °C	70 °C	70 °C	85 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	SSOP	TSSOP	TSSOP	SSOP	SSOP
Encapsulate equivalent code	TSSOP28,.25	SSOP28,.3	TSSOP28,.25	TSSOP28,.25	SSOP28,.3	SSOP28,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Prop。Delay @ Nom-Sup	0.15 ns	0.15 ns	0.15 ns	0.15 ns	0.15 ns	0.15 ns
propagation delay (tpd)	0.15 ns	0.15 ns	0.15 ns	0.15 ns	0.15 ns	0.15 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Same Edge Skew-Max（tskwd）	0.045 ns	0.045 ns	0.045 ns	0.045 ns	0.045 ns	0.045 ns
Maximum seat height	1.2 mm	2 mm	1.2 mm	1.2 mm	2 mm	2 mm
Maximum supply voltage (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES
Temperature level	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	4.4 mm	5.3 mm	4.4 mm	4.4 mm	5.3 mm	5.3 mm
Base Number Matches	1	-	1	1	-	1

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